A kind of thermal etching method for pattern making of amb copper-clad ceramic substrate

Abstract

The invention provides a thermal etching method for pattern making of an AMB copper-clad ceramic substrate, comprising five processes of surface protective film pressing, laser start-up, protective film thermal etching, cleaning, and copper layer etching. First, press the surface protective film onto the substrate to be thermally etched under the following conditions: pressing temperature: 110-120°C; pressing machine speed: 2.5-3.5m / min; pressing pressure: 3.5-4.5kg / cm 2 ; Then start the low-power laser in the galvanometer mode, set the power to less than 50W, and import the pattern of the thermally etched area in the design software into it; thirdly, turn the laser scanning galvanometer at 0-45° to the surface protective film Carry out thermal etching once in X and Y directions, the pulse width used is 10-30μs, the laser frequency is 5-30KHz, the duty cycle is 30-90%, the number of engravings is 1-5 times, and the initial filling angle is 30 ~ 60 degrees, the progressive angle is 60 ~ 120 degrees; then after cleaning and copper layer etching, the AMB copper-clad ceramic substrate pattern is obtained.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad ceramic substrates such as semiconductor refrigerators, LEDs, and power semiconductors, and in particular to a thermal etching method for pattern production of AMB copper-clad ceramic substrates. Background technique [0002] At present, the pattern transfer process of active metal brazing (AMB) copper-clad ceramic substrates is generally completed by the traditional process of film attachment, exposure, and development, or the LDI (laser direct imaging) scanning exposure, and development process, but both forms are used in actual production. Encountered many problems: [0003] For the traditional process of film sticking, exposure, and development, film exposure is used, which requires high cleanliness of film. In addition, the poor alignment accuracy of the film will lead to product misalignment and increased copper defects, leading to a high scrap rate of AMB substrates, whil...

AI Technical Summary

Problems solved by technology

However, while curing the material, it is sensitive to the chemical properties and material composition of the photosensitive material. At the same time, the large diameter of the focus spot and the difficulty in controlling the laser wavelength lead to a decrease in resolution, which makes the circuit board prone to wiring, overexposure, and jagged edges, etc., resulting in product scrapping.

Moreover, the optical path of LDI laser is relatively complicated, it is difficult to debug, and the maintenance cost is also high

[0005] In addition, the development process is required after the two exposure methods, which increases the production cost and has a certain adverse impact on the environment

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