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Heat dissipation device and preparation method thereof and electronic equipment

A heat dissipation device and technology for electronic equipment, which is applied in the field of heat conduction, can solve the problems of limiting the thinness of electronic equipment, occupying the space of electronic equipment, and large volume of heat dissipation devices, achieving outstanding heat dissipation performance, improving heat dissipation performance, and reducing the thickness of the whole machine.

Active Publication Date: 2020-02-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large size and heavy weight of traditional heat sinks, it takes up a lot of space in electronic equipment, which greatly limits the development of electronic equipment towards thinner and lighter

Method used

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  • Heat dissipation device and preparation method thereof and electronic equipment
  • Heat dissipation device and preparation method thereof and electronic equipment
  • Heat dissipation device and preparation method thereof and electronic equipment

Examples

Experimental program
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Effect test

preparation example Construction

[0066] The preparation method provided by the second aspect of the present application has a simple process and can realize large-scale industrial production; by forming a strong capillary force between the boss on the first cover and the hydrophilic coating on the second cover, The capillary channel structure accelerates the return flow of the working fluid in the heat sink during the heating process, prompts the heat sink to repeatedly absorb heat, conduct heat, and dissipate heat, and improves the heat dissipation performance of the heat sink; at the same time, the capillary channel structure in the heat sink can The traditional heavy liquid-absorbing core structure is omitted, the production cost is reduced, and the total thickness of the heat dissipation device is greatly reduced.

[0067] Wherein, in the embodiment of the present application, in said S100, in the process of forming at least two grooves arranged at intervals on the first cover plate, it also includes forming...

Embodiment 1

[0075] Such as Figure 11 As shown, a heat sink 500 prepared by the method for preparing a heat sink provided in an embodiment of the present application, wherein, in the heat sink 500, the thickness H5 of the first cover plate 1 and the height of the support column 6 are 0.15mm, wherein the first The distance D1 between the bottom of the groove 11 of the cover plate 1 and the surface of the second cover plate 2 is 0.12 mm, the cross-sectional width L1 of the groove 11 is 0.8 mm, and the cross-sectional width L2 of the boss 12 is 1.0 mm. The height H1 of the platform 12 is 1.2mm, the distance H2 between the side surface of the boss 12 close to the hydrophilic coating 21 and the hydrophilic coating 21 is 0.03mm, and the thickness H3 of the hydrophilic coating 21 is about 0.001 mm, the thickness H4 of the second cover plate 2 is 0.07 mm. The total thickness of the heat sink 500 is only 0.25mm. The first cover plate 1 and the second cover plate 2 are closed by welding with sold...

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Abstract

The invention provides a heat dissipation device and a preparation method thereof and electronic equipment. The heat dissipation device comprises a first cover plate, a second cover plate and workingfluid. At least two grooves are formed in the first cover plate at intervals, and a boss is arranged between every two adjacent grooves. The second cover plate covers the first cover plate to form a closed containing cavity. A hydrophilic coating is arranged at each of the positions, corresponding to the bosses, of the second cover plate. A capillary channel is formed between each boss and the corresponding hydrophilic coating. The containing cavity is filled with the working fluid. A traditional thick liquid absorption core structure is omitted in the heat dissipation device, the total thickness of the heat dissipation device is greatly reduced, and the heat dissipation device has good heat dissipation performance.

Description

technical field [0001] The application belongs to the technical field of heat conduction, and in particular relates to a heat dissipation device, a preparation method thereof, and electronic equipment. Background technique [0002] In recent years, electronic equipment is tending to be thinner and thinner, and as the functions of electronic equipment become more and more powerful, the power consumption of corresponding electronic equipment is also increasing, which directly leads to a sharp rise in the temperature of components in electronic equipment. High; it is necessary to quickly dissipate the heat in time with the aid of a cooling device. However, due to the large size and heavy weight of the traditional heat sink, it takes up a lot of space in the electronic equipment, which greatly limits the development of the electronic equipment towards thinner and lighter. Contents of the invention [0003] The application provides a heat dissipation device with outstanding he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20336
Inventor 杨鑫
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD