Component manufacturing device and component manufacturing method

A technology for manufacturing devices and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, electrical components, etc.

Pending Publication Date: 2020-02-07
MITSUI CHEM TOHCELLO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the following Patent Document 2 discloses a problem related to a component holding film used as a carrier in the above-mentioned evaluation step of this method.

Method used

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  • Component manufacturing device and component manufacturing method
  • Component manufacturing device and component manufacturing method
  • Component manufacturing device and component manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0174] Hereinafter, the present invention will be specifically described by way of examples.

[0175] [1] Manufacture of part holder

[0176] Manufacture of the component holding film 52

experiment example 1

[0178] As the base layer 521, a polyester-based thermoplastic elastomer (TPEE) film having a thickness of 80 μm was prepared. Using this film, the tensile modulus E' was measured with a dynamic viscoelasticity measuring device (DMA: Dynamic Mechanical Analysis) (product name: RSA-3, manufactured by TA Instruments). Specifically, the sample size is 10 mm in width and 20 mm in length between chucks, measured from -50°C to 200°C under the measurement conditions of a frequency of 1 Hz and a heating rate of 5°C / min, and reading data for each temperature from the obtained data . Furthermore, the value at 25°C is defined as the tensile modulus E'(25), and the value at 160°C is defined as the tensile modulus E'(160), as shown in Table 1. Further, using these values, calculate the ratio R E1 (=E'(160) / E'(25)) and the results are shown in Table 1 together. As a result, the ratio R in Experimental Example 1 E1 is 0.13.

[0179] Next, a non-curable acrylic adhesive with a thickness o...

experiment example 2

[0181] As the base layer 521 , a polyester-based thermoplastic elastomer (TPEE) film with a thickness of 150 μm was prepared. This film is different from the film of Experimental Example 1 only in thickness. Otherwise, the member holding film 52 of Experimental Example 2 was obtained in the same manner as in Experimental Example 1.

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PUM

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Abstract

The purpose of the present invention is to provide a component manufacturing device and a component manufacturing method with which a component holding film can be correctly suction-attracted and fixed onto a chuck table while being heated. The component manufacturing device 1 is provided with: a suction-attracting / fixing means 20 which suction-attracts and fixes a component holding film onto a suction-attract surface 21a being heated; and a blocking means 30 which blocks a thermal convection generated on the suction-attract surface 21a from hitting the component holding film. The component manufacturing method comprises a setting step of suction-attracting and fixing a component holding film onto a suction-attract surface 21a being heated, wherein the setting step includes a blocking stepof blocking a thermal convection generated on the suction-attract surface 21a from hitting the component holding film.

Description

technical field [0001] The present invention relates to a component manufacturing device and a component manufacturing method. In more detail, it is related with the component manufacturing apparatus which manufactures a semiconductor component, the component manufacturing apparatus which manufactures an electronic component, the component manufacturing method which manufactures a semiconductor component, and the component manufacturing method which manufactures an electronic component. Background technique [0002] When manufacturing semiconductor components and electronic components, evaluation (inspection) is performed after necessary steps, and only components that pass the evaluation are sent to subsequent steps. According to this method, it is possible to eliminate wasted effort in manufacturing from the front stage of the process, and it is possible to improve the yield of the final product. Its outline, for example, is disclosed in the following patent document 1 (r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/677H01L23/12
CPCH01L21/677H01L21/683H01L23/12H01L21/67109H01L21/68785H01L21/6838H01L21/6836H01L21/687
Inventor 林下英司
Owner MITSUI CHEM TOHCELLO INC
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