Wafer processing thinning machine

Abstract

The invention discloses a wafer processing and thinning machine, the structure of which includes a cover, a grinding head, a switch, a suction cup structure, a body, and a control panel. , a switch is installed between the cover and the body, a grinding head is installed in the middle of the inner wall of the cover, and a suction cup structure is installed on the top surface of the body corresponding to the grinding head, and the suction cup structure and the grinding head cooperate with each other. The unique trachea design separates the suction port on the suction cup independently. When it is broken by force, no matter which direction the wafer cracks from, it can be absorbed, and will not fall on the table due to the loss of suction, causing secondary cracking. The invention The plug design, when not in use or when the air pipe is reduced, the installation hole of the suction cup is blocked to reduce the blockage caused by the entry of air dust.

Description

technical field [0001] The invention relates to the field of wafer processing equipment for chips, in particular to a wafer processing and thinning machine. Background technique [0002] In the wafer manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness, and surface microlattice structure of the wafer. Therefore, in hundreds of processes, thinner wafers cannot be used, and only a certain thickness can be used. During the transfer and tape-out of the wafers in the process, usually before the integrated circuit packaging, it is necessary to remove a certain thickness of the excess substrate material on the back of the wafer. This process is called the wafer back thinning process, and the corresponding equipment is the wafer thinning machine. During the thinning process, because the thickness of the middle and edge of the wafer is inconsistent, when removing the middle thickness, it will be different due to its ...

AI Technical Summary

Problems solved by technology

This process is called the wafer back thinning process, and the corresponding equipment is the wafer thinning machine. During the thinning process, because the thickness of the middle and edge of the wafer is inconsistent, when removing the middle thickness, it will be different due to its different strength. , leading to breakage, the suction cup cannot be absorbed, and it falls directly to the workbench, becoming broken and troublesome to clean up

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