AC reliability test circuit and method for broadband device

Abstract

The invention discloses an AC reliability test circuit and method for a broadband device. The test circuit is additionally provided with two core modules, namely a voltage applying driving module anda low dropout linear regulator; the voltage applying driving module provides a waveform for the device to be tested, and the low dropout linear regulator provides power for the voltage applying driving module; output of the low dropout linear regulator has extremely low impedance at low frequency, and the low dropout linear regulator itself has a relatively high power supply rejection ratio, so that parasitism at the low frequency can be almost ignored; and at high frequency, a decoupling capacitor plays a key role, and high-frequency impedance is influenced by the capacitor and is basically low in resistance. Thus, probe parasitism is avoided from influencing distortion of test waveform, and the accuracy is greatly improved compared with a traditional test scheme.

Description

technical field [0001] The invention relates to the technical field of semiconductor device reliability testing, and more specifically relates to a wide-band device AC reliability testing circuit and testing method. Background technique [0002] At present, in order to ensure that the performance of semiconductor devices is more stable during use, it is usually necessary to test the reliability of the device, or to evaluate the working life of the device, for example, once the device exceeds a certain limit (including voltage, current or power, etc.) , the device is likely to fail. Doing reliability analysis and testing has at least the following meanings: [0003] 1. Find out the working condition boundary of the device, especially the extreme working condition, so that the circuit life can be well evaluated during the use of the device, so that it is not easy to exceed the design boundary in the design process and introduce the risk of chip failure . For example, design...

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Problems solved by technology

[0005] 3. Under different conditions, the results of reliability are not consistent. The research on device reliability and the analysis of quantitative test results can provide more accurate design references. Some tools will provide some tools to evaluate the service life of devices, but these tools Often too conservative to provide a realistic close to reality, requiring specific tests to assess the relationship between the tool and the reality

[0006] Taking NMOS in the CMOS process as an example, there are several main problems in its working reliability: such as hot carrier effect (HCI), dielectric breakdown over time (TDDB) and bias thermal instability (BTI), etc. These may cause device degradation or even failure under different circuits and conditions, especially for analog circuits, reliability analysis is more important

Common test methods such as figure 2 As shown, the DC Probe is used directly to measure the voltage and current of three nodes. This method is simple to implement. The device under test (DUT) is directly connected to the PAD, and then tested by the DC Probe, but this interface is only suitable for DC testing. , or very low frequency reliability test, unable to cover from DC to high frequency band, to verify the wide frequency band characteristics of a device

[0008] At the same time, because the DC pin is very long, the parasitic is very large. In the AC test, it will introduce non-ideal distortion of the waveform, such as image 3 As shown, the above shows the reference waveform. In the case of parasitic, the actual waveform to the input port of the device is image 3 The waveform at the middle and bottom, so the waveform is distorted between the input ideal signal and the signal received by the actual device, which produces a certain deviation, and the reliability characteristics of the device cannot be accurately estimated

In actual testing, unsatisfactory test waveforms will greatly reduce the reference value of the measured degradation characteristics or failure characteristics of the device

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