heat sink

Abstract

The present invention provides a heat sink that can uniformize the heat of the heat receiving part and increase the volume of the heat receiving part, and prevent the thermal resistance of the heat receiving part from increasing even if the calorific value of the heat generating body increases, thereby affecting the cooling effect. Object exerts excellent cooling properties. The radiator includes: a heat transfer component having a heat receiving portion thermally connected to the heating element; a pipe body connected to the heat insulation portion or heat dissipation portion of the heat transfer member; a cooling fin group thermally connected to the pipe body, and A plurality of cooling fins are arranged; the heat transfer member has an integrated internal space, which connects the heat receiving part to the connection part connected with the pipe body, and is sealed with working fluid, and the heat transfer member The inner space of the pipe communicates with the inner space of the pipe body.

Description

technical field [0001] The present invention relates to a heat sink for cooling electric / electronic parts and the like, and particularly relates to a heat sink which can be installed in a narrow space. Background technique [0002] With the multifunctionalization of electronic equipment, heating elements such as electronic components are mounted at high density inside the electronic equipment. A fan heater can be used as a method of cooling a heat generating body such as an electronic component. As the heat sink, a heat sink including a tubular heat pipe (heat pipe type heat sink) is generally used. [0003] As a heat pipe type heat sink, for example, there is a heat pipe type heat sink provided with a plurality of flat fins protruding from the outer peripheral surface of a plurality of tubular heat pipes provided (Patent Document 1). The heat sink of Patent Document 1 is a heat sink configured to transfer heat from a heat generating body to fins through a plurality of tub...

AI Technical Summary

Problems solved by technology

However, there is a problem that if the flat parts of the heat pipes are arranged side by side in the vertical direction, the heat receiving area of ​​each heat pipe will be reduced, so the thermal resistance will increase, and sufficient cooling characteristics will not be exhibited.

[0007] As mentioned above, if the heat pipe group formed by a plurality of heat pipes is thermally connected to the heating body, the heat in the heat receiving part of the heat pipe group cannot be uniformed sufficiently, and the thermal resistance between the heat receiving part of the heat pipe group and the heat generating body increases, Therefore, the cooling characteristics cannot be sufficiently improved

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