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Additive for electrotinning process of methylsulphonic acid method

A technology of methanesulfonic acid method and electroplating tin, which is applied in the field of additives and can solve problems such as difficult process procedures

Active Publication Date: 2020-02-14
QUAKER CHEM CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This not only brings certain difficulties to the process

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  • Additive for electrotinning process of methylsulphonic acid method
  • Additive for electrotinning process of methylsulphonic acid method
  • Additive for electrotinning process of methylsulphonic acid method

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Embodiment Construction

[0030] In order to further understand the present invention, the preferred embodiments of the present invention will be described below in conjunction with examples, but it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, rather than limiting the claims of the present invention.

[0031] According to a preferred embodiment of the present invention, the additive used in the methanesulfonic acid method tin electroplating process will be described in detail below. In this embodiment, the additive used in the methanesulfonic acid method tin electroplating process is The modified product of phenolsulfonic acid, specifically the binary substituent on the benzene ring in phenolsulfonic acid, in which two substituents are respectively replaced by R 1 And R 2 .

[0032] In the first embodiment of the present invention, the additive of the tin electroplating process in the methanesulfonic acid method is a modi...

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Abstract

The invention discloses an additive for the electrotinning process of a methylsulphonic acid method. The additive for the electrotinning process of the methylsulphonic acid method is a binary substitute on a benzene ring in phenolsulfonic acid, wherein two substituting groups are R1 and R2, R1 is polyoxyethylene ether (EO) or a polyoxyethylene ether and polyoxypropylene ether segmented copolymer (EO-PO-EO), the structural formula of the polyoxyethylene ether (EO) and the structural formula of the polyoxyethylene ether (EO) and polyoxypropylene ether segmented copolymer are shown in the specification, n is 20-100, m is 20-50, R1 has the molecular weight of 2000-6000, the substituting group R2 is polysiloxane or polyoxypropylene ether, the structural formula of the substituting group R2 is shown in the specification, k is 1-20 and J is 1-20.

Description

Technical field [0001] The invention relates to an additive, in particular to an additive for tin electroplating process by methanesulfonic acid method. Background technique [0002] Tinplate, commonly known as tinplate, is a common packaging material. This packaging material is characterized by tin plating on both sides of cold-rolled low-carbon thin steel sheets or steel strips. Tin mainly plays a role in preventing corrosion and rust. It combines the strength and formability of steel with the corrosion resistance, solderability and beautiful appearance of tin in a single material. It has the characteristics of corrosion resistance, non-toxicity, high strength and good ductility. [0003] In the prior art, tin electroplating methods mainly include halogen method, phenol sulfonic acid (PSA) method and methane sulfonic acid (MSA) method. The advantages and disadvantages of the above three methods have been described in many documents, such as: Sun Xueliang, Huang Yongjun, Mei Hu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 施闽
Owner QUAKER CHEM CHINA
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