The invention provides a deplating solution. The deplating solution comprises the following components in percentage by weight: 10%-30% of
sulfuric acid, 0.5%-1.5% of stannous mono-sulphate, 0.5%-2.5% of
sodium sulfate, 0.5%-2.5% of a complexing agent, 0.1%-0.5% of an
antioxidant, 1%-3% of a
copper protection agent, 0.1%-0.5% of an additive and the balance of water, wherein the complexing agent is any one or two of
sulfamic acid,
methanesulfonic acid,
phenolsulfonic acid and
citric acid; the
antioxidant is any one of
resorcinol,
hydroquinone and
ascorbic acid; the
copper protection agent is a core-shell structure
corrosion inhibition
microsphere, the core-shell structure
corrosion inhibition
microsphere takes hollow
silicon dioxide as a core, the surface of the core-shell structure
corrosion inhibition
microsphere is grafted with
benzotriazole, the outer layer of the core-shell structure corrosion inhibition microsphere is coated with a layer of pH sensitive type polymethylacrylic acid hydrogel shell, and the particle size is controlled to be 5-20 microns; the additive is any one of
polyethylene glycol and
gelatin. By optimizing the formula of the deplating solution and especially upgrading the
copper protection agent
system, efficient and lossless deplating of the
tin-containing plating layer is achieved, meanwhile, the
tin and copper
recovery purity is improved, and the service life of the deplating solution is prolonged.