An electroplating solution adding injection device for pcb circuit board electroplating

Abstract

The invention discloses an electroplating solution adding and spraying device for electroplating of a PCB. The electroplating solution adding and spraying device comprises an electroplating device, acleaning device, a draining track, a material fixing device, a grinding device and a feeding conveyor belt, wherein a material transferring device is fixedly arranged on the grinding device and arranged above the position between the material fixing device and the draining track; the cleaning device is used for cleaning an electroplated substrate; the material transferring device transfers drainedmaterials to the material fixing device; the material fixing device is used for fixing the substrate and conveying the fixed substrate to the position below the grinding device; and the grinding device is used for grinding the substrate. According to the electroplating solution adding and spraying device, in the whole electroplating process, a material conveying rope moves continuously, the wholeelectroplating process is conducted continuously, and the production efficiency is improved; and the material fixing device achieves the effect of fixing the substrate and also achieves the effect oftransferring the materials, a large-span transferring device is avoided, the number of transferring devices used in the process is decreased, and the complexity of a production line is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board processing, and in particular relates to an electroplating solution adding and spraying device for PCB circuit board electroplating. Background technique [0002] The printed circuit board is an electrical structure that forms an electroplating layer on the surface of the substrate, and then etches the electroplating layer to form a circuit pattern by etching. Its high-density circuit structure makes it mainly used in small and lightweight electronic products. . [0003] In the prior art, when the printed circuit board is prepared, the substrate of the circuit board is mainly soaked in the electroplating solution, and then the substrate is used as the cathode, and electroplating is applied to form a layer of electroplating layer on the surface of the substrate. Specifically, During the soaking process, the electroplating solution needs to be sprayed to the electroplating surface of ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the printed circuit board is prepared, the substrate of the circuit board is mainly soaked in the electroplating solution, and then the substrate is used as the cathode, and electroplating is applied to form a layer of electroplating layer on the surface of the substrate. Specifically, During the soaking process, the electroplating solution needs to be sprayed to the electroplating surface of the PCB substrate at high speed through the nozzle. In the prior art, the PCB substrate is hoisted and transferred to the top of the electroplating box, and then the substrate is lowered into the electroplating box for immersion. However, this method cannot form continuous production, which greatly reduces production efficiency and does not meet the economic benefits of production. In addition, in the electroplating production process, due to many processes, a large number of transfer equipment will be used to transfer the substrate between each process. Carrying out the transfer increases the production cost and the complexity of the production line. In order to solve the above problems, the present invention provides the following technical solutions

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