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Detection module package structure and method for diamond sensor test

A technology of module packaging and sensors, which is applied in the direction of measuring device shells, instruments, etc., can solve problems such as difficult disassembly of detector modules, and achieve the effects of avoiding uncontrollable errors, low system noise, and low background dark current

Active Publication Date: 2020-02-14
INSPUR GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical task of the present invention is to provide a detector module packaging structure and method for diamond sensor testing, to solve the disadvantages of traditional packaging solutions that can only package a piece of diamond sensor and the detector module is difficult to disassemble

Method used

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  • Detection module package structure and method for diamond sensor test
  • Detection module package structure and method for diamond sensor test
  • Detection module package structure and method for diamond sensor test

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Embodiment 1

[0046] as attached figure 1 As shown, the package structure of the detector module for diamond sensor testing of the present invention includes a ceramic-based printed circuit board, an insulating gasket and a sensor, and the ceramic-based printed circuit board is provided with two parallel ceramic-based printed circuit boards. set and adopt double-sided circuit design structure, as attached figure 2 and 3 As shown, the center of one side of the ceramic-based printed circuit board with a double-sided circuit design structure is provided with four separate square metal electrodes, and the other side is the lead connection point connected to the metal electrodes through the hole making process; the insulating gasket is located on the Between the two ceramic-based printed circuit boards, the insulating gasket is provided with holes corresponding to the square metal electrodes of the ceramic-based printed circuit board; there are four sensors, and the four sensors are located be...

Embodiment 2

[0049] The method for encapsulating a detector module for diamond sensor testing of the present invention has the following steps:

[0050] S1. The sensor is prepared from a diamond wafer grown by CVD method; a composite metal film is coated on both surfaces of the diamond wafer by magnetron sputtering, the size of the mask is required to be smaller than the size of the diamond wafer, and the structure of the composite metal film is the bottom Ti film-the middle layer W film —Au film on the surface layer; the thickness of the bottom Ti film is 50nm, the thickness of the W film in the middle layer is 200nm, and the thickness of the Au film on the surface layer is 30nm; the bottom Ti film combines with the carbon atoms on the surface of the diamond to form TiC, which can strengthen the metal film and diamond surface in the subsequent annealing process The surface adhesion between diamonds and build a good ohmic contact; the surface layer Au film is used to reduce the contact resi...

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Abstract

The invention discloses a detection module package structure and a method for diamond sensor test, belonging to the technical field of semiconductor test module package. A technical problem, which needs to be solved by the structure and the method, is that the conventional package scheme can only package one diamond sensor and a detector module is hard to detach. A technical scheme is used as follows: the detection module package structure structurally comprises ceramic base printed circuit boards, an insulating spacer and a sensor, two ceramic base printed circuit boards are arranged, the twoceramic base printed circuit boards are longitudinally parallel to each other and both use a double-sided circuit design structure, a central position of one surface of the ceramic base printed circuit board of the double-sided circuit design structure is provided with four separately arranged square metal electrodes, and the other surface is connected to a lead connection point on the metal electrode through a holing technology; the insulating spacer is provided with a hole position corresponding to the square metal electrode of the ceramic base printed circuit board. The invention also discloses a detector module package method for diamond sensor test.

Description

technical field [0001] The invention relates to the packaging field of semiconductor test modules, in particular to a detector module packaging structure and method for diamond sensor testing. Background technique [0002] As the hardest material existing in nature, diamond has excellent mechanical properties and thermal conductivity. In addition, due to the formation of sp between the carbon atoms that make up the diamond 3 Hybrid orbitals, and the arrangement of carbon atoms has a very strong periodicity, and diamond itself has strong radiation resistance; the above properties make the sensor based on the diamond wafer still have a good response in the extremely harsh radiation environment Therefore, the new detector made of diamond as the sensor material has become a research hotspot in recent years at home and abroad. [0003] The traditional test diamond detector module packaging scheme generally only places a diamond sensor on a ceramic-based printed circuit board. T...

Claims

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Application Information

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IPC IPC(8): G01D18/00G01D11/26
CPCG01D11/26G01D18/00
Inventor 刘幼航刘强聂鸿飞
Owner INSPUR GROUP CO LTD
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