Package structure with electromagnetic shielding function and packaging method thereof

Abstract

The invention discloses a package structure with an electromagnetic shielding function and a manufacturing method thereof. The package structure includes a flexible substrate layer (10), a chip (30),a metal fence (50), a molding component cladding layer (60) and an electromagnetic shielding layer (80), wherein the chip (30) is inverted on a part of an upper metal pad (131) on the upper surface ofthe flexible substrate layer (10); the metal fence (50) is arranged on another part of the upper metal pad (131) around the chip (30); the electromagnetic shielding layer (80) is buckled in a cap shape above the flexible substrate layer (10); the cap crown of the electromagnetic shielding layer (80) accommodates the chip (30), and the cap brim of the electromagnetic shielding layer (80) is connected with the metal fence (50); the electromagnetic shielding layer (80), the metal fence (50) and a plurality of metal circuit layers in the flexible substrate layer (10) are combined to make the chipto be placed in a metal enclosed space. According to the invention, grounding and shielding effects can be effectively improved, the process can be simplified, and the production efficiency and product yield can be effectively improved.

Description

technical field [0001] The invention relates to a packaging structure with an electromagnetic shielding function and a packaging method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the rapid development of science and technology and the electronic industry, various digital and high-frequency electronic components radiate a large number of electromagnetic waves of different frequencies and wavelengths into space when they are working. Electromagnetic radiation and electromagnetic waves not only interfere with the realization of the performance of electronic components, but also cause serious harm to humans and other living things. With the development of 5G technology, the demand for electromagnetic shielding devices in communication and consumer electronics continues to grow, and the requirements for electromagnetic shielding are getting higher and higher. Therefore, electromagnetic shielding has become a necessary...

AI Technical Summary

Problems solved by technology

The current electromagnetic shielding scheme usually uses five-sided electromagnetic shielding materials on the upper surface and four side walls of the product. It is necessary to perform electromagnetic shielding layer operations on the surface of a single product after cutting a single product. This operation process is relatively long. , and the utilization rate of the electromagnetic shielding layer material is relatively low, and the cost is high; the electromagnetic shielding layer needs to be the entire surface on the side, and the bonding force between it and the bottom surface is prone to weak bonding, which affects the performance and reliability of the product. property; at the same time, the phenomenon of weak binding force will cause the loss of product yield

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