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Electrochemical Preparation of Aligned Carbon Nanotubes Embedded with Copper Nanoparticles

A technology of copper nanoparticles and carbon nanotubes, applied in jewelry and other directions, can solve the problems of cumbersome process, time-consuming, reducing copper azide sensitivity, etc., and achieve the effect of improving deposition density and avoiding agglomeration

Active Publication Date: 2022-01-11
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

V. Pelletier et al. first deposited carbon nanotubes in porous alumina channels by CVD, and then dropped the CuO colloidal solution drop by drop on the porous alumina surface of vapor-deposited carbon nanotubes, so that CuO nanoparticles entered the carbon nanotubes. , remove porous alumina and then reduce CuO to Cu nanoparticles by hydrogen, and finally copper azide is filled in carbon nanotubes, the performance of carbon nanotubes is used to reduce the sensitivity of copper azide, but CuO nanoparticles are added drop by drop Colloidal solution, not only time-consuming, but also cumbersome process, at the same time, the density distribution of copper nanoparticles prepared by reduction in carbon nanotubes is very low (Pelletier V, Bhattacharyya S, Knoke I, et al. Copper Azide ConfinedInside Templated Carbon Nanotubes[J]. Advanced Functional Materials, 2010, 20(18):3168–3174.)

Method used

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  • Electrochemical Preparation of Aligned Carbon Nanotubes Embedded with Copper Nanoparticles
  • Electrochemical Preparation of Aligned Carbon Nanotubes Embedded with Copper Nanoparticles
  • Electrochemical Preparation of Aligned Carbon Nanotubes Embedded with Copper Nanoparticles

Examples

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preparation example Construction

[0022] References for the preparation of aligned carbon nanotubes [Guo Rui, Preparation method and application of carbon nanotube-filled oxidant composite energetic materials [D]; Nanjing University of Science and Technology, 2016]. Specifically:

[0023] 1) Weigh 37.82g of oxalic acid dihydrate and dissolve it in 1L of water to prepare a 0.3mol / L oxalic acid solution, weigh 6g of phosphoric acid and 1.8g of chromium trioxide and dissolve it in 92.2ml of water to prepare 6wt% phosphoric acid and 1.8wt% Tris For the mixed solution of chromium oxide, take 5g of phosphoric acid and dissolve it in 95ml of water to prepare 5wt% pore-enlarging solution. Use a 15*15mm aluminum-plated silicon chip as the anode, use a platinum sheet as the cathode, and use a DC power supply of 45V to oxidize for 16 minutes at a constant voltage; After one-step anodizing, put it into a mixed solution of phosphoric acid and chromium trioxide and place it in a constant temperature water bath at 70°C for 3...

Embodiment 1

[0026] Dissolve 2.5g of copper sulfate pentahydrate and 2.5g of boric acid in water to prepare 100mL of electrolytic solution, and add 1mg of thiourea and 10mg of polyvinylpyrrolidone, that is, the additives used are 10mg / L of thiourea and 0.1g / L of polyethylene pyrrolidone. The porous alumina deposited with carbon nanotubes on the inner wall of the channel was used as the cathode, and the platinum wire electrode was used as the anode. The current density was controlled at 0.1mA, the constant current electrodeposition was 3h, and the temperature was 30°C. After the deposition, the sample was taken out, soaked in deionized water, and then put into a 6mol / L sodium hydroxide solution to remove the porous alumina template to obtain aligned carbon nanotubes embedded with copper nanoparticles, as shown in the transmission electron microscope image 3 .

[0027] From image 3 , Figure 4 and Figure 5 It can be seen that when thiourea and polyvinylpyrrolidone are used as additive...

Embodiment 2

[0031] This example is basically the same as Example 1, except that the additives used are 15mg / L thiourea and 0.1g / L polyvinylpyrrolidone to obtain aligned carbon nanotubes embedded with copper nanoparticles, as shown in the transmission electron microscope Figure 4 .

[0032] From Figure 4 It can be seen that when the concentration of the thiourea additive is 15 mg / L, the prepared copper nanoparticles are deposited in the carbon nanotubes, the density of the copper nanoparticles does not decrease, and the copper particles do not agglomerate.

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Abstract

The invention discloses an electrochemical preparation method of aligned carbon nanotubes embedded with copper nanoparticles. In the method, the porous alumina deposited with carbon nanotubes on the inner wall of the channel is used as the cathode, and the platinum wire electrode is used as the anode, and the hollow lumen of the aligned carbon nanotubes is formed by electrochemical deposition with the help of chemical additives thiourea and polyvinylpyrrolidone. Nano-copper particles are deposited inside, and the copper nanoparticles are uniformly embedded in the hollow cavity of the carbon nanotube. The method of the invention not only improves the deposition density of the copper nanoparticles in the hollow cavity of the aligned carbon nanotube, but also avoids the agglomeration of the copper nanoparticles.

Description

technical field [0001] The invention relates to an electrochemical preparation method of oriented carbon nanotubes embedded with copper nanoparticles, belonging to the technical field of nanomaterial preparation. Background technique [0002] Metal nanomaterials have good electrical conductivity, small size effect, macroscopic quantum tunneling effect and high surface chemical activity, and have great application value. The preparation methods of metal nanomaterials include mechanical crushing method, evaporation condensation method, hydrothermal synthesis method, spray pyrolysis method, precipitation method and so on. V. Pelletier et al. first deposited carbon nanotubes in porous alumina channels by CVD, and then dropped the CuO colloidal solution drop by drop on the porous alumina surface of vapor-deposited carbon nanotubes, so that CuO nanoparticles entered the carbon nanotubes. , remove porous alumina and then reduce CuO to Cu nanoparticles by hydrogen, and finally copp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D5/54C25D7/00
CPCC25D3/38C25D5/54C25D7/00
Inventor 胡艳魏海叶迎华沈瑞琪
Owner NANJING UNIV OF SCI & TECH
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