A diamond wire saw and its rapid production method

Abstract

The invention discloses a diamond wire saw and a rapid production method thereof. The diamond abrasive grains are coated with a nickel layer on the surface by electroless plating, and are fixed on the copper-plated music wire substrate with a pre-nickel-plated layer through the nickel-plated layer, and thickening the nickel layer makes the abrasive grains consolidate more firmly. The rapid production method of the diamond wire saw comprises the following steps: 1. removing the surface grease and oxides of diamond abrasive grains, and sensitizing, activating and electroless nickel-plating; 2. removing the surface grease and oxides of the metal substrate, and pre-plating The nickel layer is used as a buffer layer; 3. Composite electroplating, thickening electroplating and heat treatment of diamond wire saws. The invention conducts electroless nickel plating on diamond abrasive grains to realize electrical conductivity, makes the abrasive grains move in an orderly manner under the action of an electric field, and realizes chemical consolidation; in addition, introduces strong stirring in the electroplating process to realize high current density electroplating, and is a diamond wire Saw industrial production provides an efficient and fast method.

Description

technical field [0001] The invention relates to a production method of a diamond wire saw, in particular to a diamond wire saw and a rapid production method thereof. Background technique [0002] With the development of industry, hard and brittle materials are widely used in various fields, mainly including silicon crystals, glass, gemstones, various stone materials, quartz crystals, ceramics, hard alloys, rare earth magnetic materials, etc. The cutting of hard and brittle materials generally has the following requirements: high efficiency, low cost, narrow kerf, no damage, no pollution, etc., and cutting processing is the most important one among various processing methods for hard and brittle materials. [0003] At present, the methods for cutting hard and brittle materials mainly include free abrasive wire saw cutting, consolidated abrasive wire saw cutting, outer circular cutting and inner circular cutting. The cutting process of the free abrasive wire saw is to deliver...

AI Technical Summary

Problems solved by technology

The cutting process of the free abrasive wire saw is to deliver the slurry with abrasive particles to the steel wire while cutting, so this cutting technology has very obvious disadvantages: low cutting efficiency, large saw kerf loss, difficult to control surface roughness and precision, slurry It is difficult to recycle materials, serious environmental pollution, etc., but the use of consolidated abrasive wire saw cutting can solve these problems very well

However, at present, most of the production of diamond wire saws uses bare diamonds for direct composite electroplating. Since diamond is an insulating material, its movement direction is not controlled by the electric field during the electroplating process, and only depends on the diamond abrasive grains in the plating solution. The irregular movement of the diamond wire saw is captured by the coating after colliding with the metal substrate, and the diamond abrasive grains also have a sedimentation movement under the action of gravity, thus reducing the probability of being captured by the coating, resulting in a very low deposition density of abrasive grains on the diamond wire saw , and produce uneven distribution of abrasive grains (accumulation or blank) and positive and negative surfaces, etc., the cutting efficiency of the diamond wire saw produced is low; in addition, the insulation of diamond abrasive grains determines that there is only a physical mosaic effect between it and the coating , the abrasive grains are not completely covered by the nickel layer, resulting in a very low holding force of the abrasive grains; at the same time, since the diamond abrasive grains are insulators, if strong stirring is introduced during the electroplating process, the irregular movement of the diamond abrasive grains will be more intense, It further reduces the probability of being trapped by the coating, so the current electroplating can only use a small current density, resulting in a very low production efficiency of the diamond wire saw

To sum up, the existing methods for producing diamond wire saws by composite electroplating have problems such as slow sanding speed, low sanding density, low abrasive grain holding force, low cutting efficiency and low production efficiency, which lead to mass industrialization of diamond wire saws. Production is difficult to achieve and cannot meet the growing domestic market demand caused by the current international situation

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