Compact jet flow heat dissipation system

Abstract

The invention provides a compact jet flow heat dissipation system which comprises a low-melting-point liquid metal flow channel. The low-melting-point liquid metal flow channel is of a flat rectangular flow channel structure. The inlet of the low-melting-point liquid metal flow channel is connected with the outlet of an electromagnetic pump. The outlet is connected with the inlet of the electromagnetic pump. A special-shaped net-shaped channel is arranged in the upper surface of the casing body of the low-melting-point liquid metal flow channel. The top of the special-shaped net-shaped channelis covered by a pressing plate. A jet flow opening communicated with the special-shaped net-shaped channel is formed in the center of the pressing plate. Liquid storage areas are arranged on the leftend and the right end of the low-melting-point liquid metal flow channel respectively. The liquid storage areas, the special-shaped net-shaped channel and the jet flow opening form a jet flow area. The jet flow opening is connected with the outlet end of a peristaltic pump through a first jet flow liquid pipeline. The inlet end of the peristaltic pump is connected with the outlet end of a liquidstorage tank through a second jet flow liquid pipeline. Two inlet ends of the liquid storage tank are connected with two jet flow liquid backflow openings of the liquid storage areas through third jetflow liquid pipelines respectively. The system provided by the invention is compact in structure and has a heat dissipation effect of high heat conduction and high heat transfer.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of semiconductor devices, and in particular relates to a compact jet heat dissipation system. Background technique [0002] With the current large-scale application of semiconductor electronic devices in the fields of communications, automobiles, shipboard aviation, and smart devices, highly integrated and high-power packaged electronic devices have become the mainstream of development. At present, the power density of devices such as ATCA servers, IGBT integrated components, and high-transfer-rate performance chips in data centers that are widely used is on a linear upward trend. At the same time, the update and development of thermal control technology is particularly important. However, the current effect is good, and the heat pipe cooling technology applied to high heat flux has temperature and volume limitations, and it has poor adaptability in different regions; the most widely used...

AI Technical Summary

Problems solved by technology

However, the current effect is good, and the heat pipe cooling technology applied to high heat flux has temperature and volume limitations, and it has poor adaptability in different regions; the most widely used liquid forced convection cooling technology faces defects such as high noise, high consumption and low efficiency.

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