A compact jet cooling system

Abstract

A compact jet heat dissipation system, including a low melting point liquid metal flow channel; the low melting point liquid metal flow channel is a flat rectangular flow channel structure, the inlet of the low melting point liquid metal flow channel is connected to the outlet of the electromagnetic pump, and the outlet is connected to the electromagnetic pump The inlet is connected; the upper surface of the shell of the low melting point liquid metal flow channel is provided with a special-shaped mesh channel, and the top of the special-shaped mesh channel is covered by a pressure plate, and a jet port connected to the special-shaped mesh channel is provided at the center of the pressure plate; The left and right ends of the low melting point liquid metal flow channel are respectively provided with liquid storage areas. The liquid storage area, the special-shaped mesh channel and the jet port together form a jet area. The jet port is connected to the outlet end of the peristaltic pump through the first jet liquid pipeline. , the inlet end of the peristaltic pump is connected to the outlet end of the liquid storage tank through the second jet liquid pipeline, and the two inlet ends of the liquid storage tank are respectively connected to the two jet liquid return ports of the liquid storage area through the third jet liquid pipeline. The invention has a compact structure and has high thermal conductivity and heat dissipation effect.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of semiconductor devices, and in particular relates to a compact jet heat dissipation system. Background technique [0002] With the current large-scale application of semiconductor electronic devices in the fields of communications, automobiles, shipboard aviation, and smart devices, highly integrated and high-power packaged electronic devices have become the mainstream of development. At present, the power density of devices such as ATCA servers, IGBT integrated components, and high-transfer-rate performance chips in data centers that are widely used is on a linear upward trend. At the same time, the update and development of thermal control technology is particularly important. However, the current effect is good, and the heat pipe cooling technology applied to high heat flux has temperature and volume limitations, and it has poor adaptability in different regions; the most widely used...

AI Technical Summary

Problems solved by technology

However, the current effect is good, and the heat pipe cooling technology applied to high heat flux has temperature and volume limitations, and it has poor adaptability in different regions; the most widely used liquid forced convection cooling technology faces defects such as high noise, high consumption and low efficiency.

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