Manufacturing method of micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device

Abstract

The invention discloses a manufacturing method of a micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device. The micro three-dimensional stacked MEMS resonance device comprises a shell, a cover cap and a chip bracket. A resonance chip is installed on a chip support through a fixing part and a resonance beam is suspended. The chip support is installed on the inner wall of the shell and electrically connected with the shell. An integrated chip installation groove is formed in the inner bottom face of the shell. An integrated chip electrically connected with the shell is installed in the integrated chip installation groove. The manufacturing method of the micro three-dimensional stacked MEMS resonance device comprises the steps of manfuctring the resonance chip; manufacturing a chip support; mounting a resonance chip on the chip bracket; installing an integrated chip in the integrated chip installation groove, and electrically connecting the integrated chipwith the shell; installing a chip support in the shell, and electrically connecting the chip support with the shell; and covering the cap at the opening of the shell for air-tight sealing. Compared with the prior art, miniaturization of the MEMS resonance device is achieved on the premise that the stability requirement of the MEMS resonance device is met.

Description

technical field [0001] The invention relates to the technical field of manufacturing MEMS resonant devices, in particular to a method for manufacturing a miniature three-dimensional stacked MEMS resonant device. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of micro-electro-mechanical systems. MEMS chip manufacturing uses microelectronic processing technology, especially three-dimensional micro-body processing technology, to manufacture various micro-mechanical structure-sensitive chips, and then integrates them with application-specific integrated circuits. Constitute miniaturized and intelligent sensors, actuators, optical devices and other MEMS devices and components, such as crystal resonators, angular velocity sensors, acceleration sensors, pressure sensors and temperature sensors. MEMS devices and components have the characteristics of small size, high reliability, strong environmental adaptability, low power consumption, low...

AI Technical Summary

Problems solved by technology

However, these methods have disadvantages: one is that it is impossible to choose a material with the same thermal expansion coefficient as the resonant chip material to make the shell; The structure of the chip is deformed; the third is that due to the limitation of volume, material and process, the structural strength of the shell cannot be increased without limit; the fourth is to further miniaturize the resonant chip and the application-specific integrated circuit, which often requires the system optimization of the overall structure and performance of the product , It is difficult and difficult to realize, and the heating phenomenon cannot be completely eliminated when the ASIC is working.

The above method cannot fundamentally solve the impact of packaging on the stability of MEMS resonant devices, and cannot effectively solve the problem of miniaturization

Images