Micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device

Abstract

The invention discloses a micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device. The device comprises a shell and a cap sealing an opening of the shell. The device also comprises a conductive chip support. The chip support and the resonance chip have the same thermal expansion coefficient; the resonance chip comprises a resonance beam and a fixing part, wherein the resonance chip is installed on the chip support through the fixing part, the resonance beam is suspended, the chip support is installed on the inner wall of the shell and electrically connected with the shell, an integrated chip installation groove is formed in the inner bottom surface of the shell below the chip support, and an integrated chip electrically connected with the shell is installedin the integrated chip installation groove. The resonance chip and the shell are connected by the chip support, so that the resonance chip is prevented from being influenced by shell deformation andthermal stress; a resonance chip, a chip support and an integrated chip are installed by adopting a three-dimensional stacked structure, the size of the MEMS resonance device is effectively reduced, and the miniature three-dimensional stacked MEMS resonance device disclosed by the invention can realize miniaturization of the MEMS resonance device on the premise of meeting the stability requirementof the MEMS resonance device.

Description

technical field [0001] The invention relates to the technical field of MEMS resonant devices, in particular to a miniature three-dimensional stacked MEMS resonant device. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of micro-electro-mechanical systems. MEMS chip manufacturing uses microelectronic processing technology, especially three-dimensional micro-body processing technology, to manufacture various micro-mechanical structure-sensitive chips, and then integrates them with application-specific integrated circuits. Constitute miniaturized and intelligent sensors, actuators, optical devices and other MEMS devices and components, such as crystal resonators, angular velocity sensors, acceleration sensors, pressure sensors and temperature sensors. MEMS devices and components have the characteristics of small size, high reliability, strong environmental adaptability, low power consumption, low cost, etc., and are widely used in aeros...

AI Technical Summary

Problems solved by technology

However, these methods have disadvantages: one is that it is impossible to choose a material with the same thermal expansion coefficient as the resonant chip material to make the shell; The structure of the chip is deformed; the third is that due to the limitation of volume, material and process, the structural strength of the shell cannot be increased without limit; the fourth is to further miniaturize the resonant chip and the application-specific integrated circuit, which often requires the system optimization of the overall structure and performance of the product , It is difficult and difficult to realize, and the heating phenomenon cannot be completely eliminated when the ASIC is working.

The above method cannot fundamentally solve the impact of packaging on the stability of MEMS resonant devices, and cannot effectively solve the problem of miniaturization

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