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Device for detecting flatness of pins of patch part

A patch component and detection device technology, applied in the direction of mechanical roughness/irregularity measurement, etc., can solve the problem of not being able to detect whether the bending part 102 at the end of the pin 101 is straight, and achieve the effect of avoiding misjudgment

Pending Publication Date: 2020-02-28
深圳市汉一科电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, this detection method cannot detect whether the bent portion 102 at the end of the pin 101 is straight or not.

Method used

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  • Device for detecting flatness of pins of patch part
  • Device for detecting flatness of pins of patch part
  • Device for detecting flatness of pins of patch part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1, such as figure 2 , image 3 with Figure 4 Shown: this embodiment is a kind of testing device that detects the flatness of the lead of chip component, and it is the necessary tooling of SMT process, and chip component has only the good flatness of pin to make chip quality good.

[0024] In this embodiment, the device for detecting the flatness of the chip component pins includes a detection plane 200; put the chip component to be detected on it for flatness detection, and this detection plane 200 uses a PCB board in this embodiment. is a flat board, such as figure 2 As shown, it is a detection tooling of a chip component 100 with 12 pins on 2. On the detection plane 200, it is on the PCB board in this embodiment, and is distributed with all pins of the chip component 100 to be tested respectively. The conductive sheet 201 corresponding to 101 is actually 2×6 sorted to stick 12 copper sheets on the PCB. The conductive sheet 201 includes two mutually insul...

Embodiment 2

[0027] Example 2 as Figure 7 with Figure 8 As shown, the difference between this embodiment and Embodiment 1 is that the detection devices for detecting the conduction of the first conductive sheet 203 and the second conductive sheet 204 are different, such as Figure 7 As shown, the detection device circuit includes a power supply VCC and a current limiting resistor R; the power supply VCC is connected to the first conductive sheet 203 in the conductive sheet 2011, and the second conductive sheet 204 is grounded through the current limiting resistor R to detect the voltage of the second conductive sheet 204 detection device. The voltage detection device is a single-chip microcomputer. When the patch component 100 is pressed on it, the single-chip microcomputer scans the voltage of the second conductive sheet 204. If there is a low voltage, it indicates that the pin flatness of the corresponding patch component 100 does not meet the requirements. Same as Embodiment 1, in t...

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PUM

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Abstract

The invention relates to a device for detecting the flatness of pins of a patch part. The device comprises a detection plane and a detection device, wherein conductive sheets respectively corresponding to all pins of the tested patch part are distributed on the detection plane, and one conductive sheet comprises a first conductive sheet and a second conductive sheet which are insulated from each other and separated by a gap; and the detection device is used for detecting whether the first conductive sheets and the second conductive sheets are conductive or not when bent parts at the tail endsof the pins of the patch part are pressed on the conductive sheets. The flatness of the pins of the patch part is turned to the problem of detecting whether the two conductive sheets are conducting ornot, and the flatness of the patch part can be detected by using the detection device for detecting whether the two conductive sheets are conducting or not, so that the misjudgment is avoided.

Description

technical field [0001] The invention relates to the field of detecting the flatness of chip pins, in particular to a device for detecting the flatness of pins of chip components. Background technique [0002] SMT is Surface Mount Technology (Surface Mount Technology), the English full name is Surface Mount Technology, which is currently the most popular technology and process in the electronics assembly industry. [0003] It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components, also known as patch components) mounted on the surface of a printed circuit board (Printed Circuit Board, PCB) or On the surface of other substrates, the circuit assembly technology is soldered and assembled by methods such as reflow soldering or dip soldering. [0004] The requirement of SMT for patch components is no leads or short leads. Since it is a patch, the bottom of the short leads needs to have a relatively flat plane, such as figu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/28
CPCG01B5/28
Inventor 何海波
Owner 深圳市汉一科电子有限公司