Novel computer memory bank sheath with active heat dissipation function

Abstract

The invention discloses a novel computer memory bank sheath with an active heat dissipation function, particularly relates to the technical field of computer memory bank sheaths. The sheath comprisesa host main board, a cooling mounting plate is fixedly mounted at the top of the host main board, a condenser pipe is embedded in the cooling mounting plate, a right-angle connecting clamping strip isdetachably mounted on the top surface of the cooling mounting plate, a sealing protective outer cover is fixedly connected to the inner side surface of the right-angle connecting clamping strip, anda memory bank socket is fixedly mounted in the middle of the top surface of the cooling mounting plate. According to the invention, the temperature sensor, the temperature control adjusting cooling switch and the temperature control adjusting unit switch are arranged; the temperature of the surface and the periphery of the memory bank is sensed and detected through the temperature sensor; when thetemperature does not reach a certain critical value, the temperature control heat dissipation unit is started through the temperature control adjusting unit switch to drive external airflow to conduct primary cooling, and when the temperature reaches the critical value or above, the micro pressure pump is started through the central control processor in cooperation with the temperature control adjusting cooling switch.

Description

technical field [0001] The invention relates to the technical field of computer memory stick sheaths, and more specifically, the invention relates to a novel active cooling computer memory stick sheath. Background technique [0002] With the rapid development of computer technology, memory modules are also rapidly updating. The memory capacity is not only based on G technology, as far as the memory stick itself is concerned, the frequency has also increased a lot. The proportion of memory with jackets has increased, but a large amount of memory is still in the streaking mode. As we all know, computer memory sticks are installed bare on the motherboard in the computer case. [0003] Due to the installation location, the computer memory sticks are generally facing the cooling fan in the chassis, because the memory sticks will generate a lot of heat when they work, and the cooling fan is needed to dissipate heat. If it blows, it will accumulate on the memory stick and the con...

AI Technical Summary

Problems solved by technology

The proportion of memory with jackets has increased, but a large amount of memory is still in the streaking mode. As we all know, computer memory sticks are installed bare on the motherboard in the computer case

[0003] Due to the installation location, the computer memory sticks are generally facing the cooling fan in the chassis, because the memory sticks will generate a lot of heat when they work, and the cooling fan is needed to dissipate heat. Not only the heat dissipation efficiency is not high, the effect is not good, and the dust is also absorbed Blowing, accumulated on the memory stick and in the connection gap between the memory stick and the motherboard, this will affect the connection between the memory stick and the motherboard after a long time, causing the computer to not work normally

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