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an optical module

A technology of optical modules and heat sinks, which is applied in the field of optical communications, can solve the problems that are not conducive to dense wiring of high-speed circuits, reduce the wiring space on the lower surface of the circuit board 10', and achieve the goals of reducing signal crosstalk, improving heat dissipation performance, and more wiring space Effect

Active Publication Date: 2021-11-19
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the heat dissipation path of the heating chip 20' on the circuit board 10' dissipates heat from the secondary heat dissipation surface of the housing through the heat dissipation pad 30', and its heat dissipation performance needs to be improved; on the other hand, the copper pouring 11' runs through the circuit board 10' Below, the wiring space on the lower surface of the circuit board 10' is reduced, which is not conducive to dense wiring of high-speed circuits

Method used

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  • an optical module
  • an optical module
  • an optical module

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Please refer to Figure 2-5 , the optical module of this embodiment includes a housing 10 , a heat dissipation block 50 disposed in the housing 10 , a circuit board 40 and a first optoelectronic chip 60 , wherein the housing 10 has a heat dissipation surface 11 .

[0034] The circuit board 40 includes a first surface 43 and a second surface 44 opposite to each other, wherein the first surface 43 is provided with a heat conduction portion 41 embedded in the circuit board 40 , and the thickness of the heat conduction portion 41 is smaller than that of the first surface of the circuit board 40 43 and the thickness between the second surface 44. The heat conduction portion 41 has an upper surface 411 adjacent to the first surface 43 of the circuit board 40 , the first optoelectronic chip 60 is mounted on the upper surface 411 of the heat conduction portion 41 and is electrically connected to the circuit board 40 . In this embodiment, the upper surface 411 of the heat condu...

Embodiment 2

[0038] like Image 6The shown embodiment 2 is different from embodiment 1 in that in this embodiment, the circuit board 40 also includes an electric chip 70, which is one of the main heat generating chips and is also mounted on the heat conducting part of the circuit board 40 The upper surface 411 of 41, the electric chip 70 is electrically connected with the above-mentioned first photoelectric chip 60 and the circuit board 40 respectively, that is, the first photoelectric chip 60 is electrically connected with the electric chip 70, and the electric chip 70 is then electrically connected with the circuit board 40 . In this embodiment, the dense heat conduction holes constituting the heat conduction portion 41 extend to the edge of the circuit board 40 , and have a larger heat conduction connection area with the heat dissipation block 50 , which speeds up the heat conduction speed and further improves the heat dissipation performance of the optical module.

[0039] In this emb...

Embodiment 3

[0041] like Figure 7 The embodiment 3 shown is different from the embodiment 1 in that in this embodiment, the heat conduction part 41 of the circuit board 40 includes a heat conduction block 414, and a groove is provided on the first surface 43 of the circuit board 40, and the heat conduction block 414 414 is embedded in the groove. The above-mentioned first optoelectronic chip 60 is mounted on the upper surface 411 of the heat conduction block 414 . The heat dissipation block 50 can be directly connected to the heat conduction block 414 through heat conduction glue, or can be connected to the heat conduction block 414 through an electrically isolated heat conduction pad 80 .

[0042] The heat conduction block 414 may be a copper block or other metal blocks with good thermal conductivity.

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Abstract

This application relates to the field of optical communication technology, and discloses an optical module, which includes a housing, a heat dissipation block arranged in the housing, a circuit board and a first optoelectronic chip; wherein, the housing has a heat dissipation surface; the first surface of the circuit board is provided with There is a heat conduction part embedded in it, and the heat conduction part has an upper surface close to the first surface of the circuit board; the first photoelectric chip is mounted on the upper surface of the heat conduction part and is electrically connected with the circuit board; The heat dissipation surface of the housing is thermally connected to the upper surface of the heat conduction part, and the heat generated by the first photoelectric chip is conducted to the heat conduction part, and then to the heat dissipation surface of the housing through the heat conduction part and the heat dissipation block. The optical module of the present application not only improves the heat dissipation performance of the high-speed optical module, but also improves the wiring space of the circuit board and the freedom of circuit design, and reduces the signal crosstalk between the optical transmitting end and the optical receiving end.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module. Background technique [0002] In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly developing in the direction of miniaturization and high density. Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, high thermal power consumption of modules has become a problem that must be faced. [0003] In response to the above problems, the existing schemes are designed as follows: figure 1 The circuit board 10' of the copper-filled heat dissipation structure can be applied in the optical module. Such circuit boards have two problems. On the one hand, the heat dissipation path of the heating chip 20' on the circuit board 10' dissipates heat from the secondary h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/428G02B6/4272
Inventor 陈龙郭金明孙雨舟
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD