Multilayer ceramic capacitor and preparation method thereof

Abstract

The invention discloses a multilayer ceramic capacitor, which comprises an effective electrode layer and a reinforcing body. The reinforcing body is arranged on at least one of the upper surface of the effective electrode layer, the inner side of the effective electrode layer and the lower surface of the effective electrode layer; the two end surfaces of the effective electrode layer and the two end surfaces the reinforcing body are in contact with end electrodes respectively; and the reinforcing body is formed by stacking a plurality of reinforcing body units, wherein each reinforcing body unit comprises a high-strength material layer and a ceramic dielectric layer, the strength of a main body material of the high-strength material layer being greater than that of a main body material ofthe ceramic dielectric layer. According to the multilayer ceramic capacitor, the high-strength material layers are uniformly distributed in the ceramic dielectric layer of the MLCC, so that the breaking strength and the bending strength of the MLCC are greatly improved on the premise of ensuring the original electrical performance of the capacitor. The invention further discloses a preparation method of the multilayer ceramic capacitor. The distribution of the reinforcing materials in the conventional dielectric layer is realized by adopting a secondary tape casting or silk-screen printing process, and more accurate and reasonable preparation of the reinforcing body can be realized.

Description

technical field [0001] The invention relates to a capacitor and a preparation method thereof, in particular to a high-strength multilayer ceramic capacitor and a preparation method thereof. Background technique [0002] Multilayer ceramic capacitors are mainly divided into two categories, Class I high-frequency ceramic capacitors and Class II high-dielectric ceramic capacitors. Among them, for Class II high-dielectric ceramic capacitors, due to the low strength of the ceramic dielectric material used, it is easy to cause vibration during use, such as welding, splitting boards, or stress or temperature fluctuations, resulting in fracture. [0003] In order to solve the above problems, at this stage, design methods such as flexible terminals or welding metal shrapnel are used to reduce stress and improve the fracture problem caused during product use. Among them, the design of the precious metal soft terminal is to add a layer of flexible precious metal plus conductive resin ...

AI Technical Summary

Problems solved by technology

This solution has the following disadvantages: 1) The cost of precious metal resin paste is high, and it is prone to problems such as poor tinning in electroplating; 2) The technical requirements for drying and co-firing of flexible terminals are fine, which generally increases the loss value of the product; 3) The product The production increase operation process has a certain impact on the product production cycle and cost

This solution has the following disadvantages: 1) increase the material and production costs of metal shrapnel, and reduce market competitiveness; 2) the operability and production automation are not high, and do not meet the conditions for mass production; The production cycle and cost have a certain impact

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