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Capacitor, capacitor package structure and manufacturing method thereof

A packaging structure and capacitor technology, applied in the direction of capacitor casing/packaging, capacitors, electrolytic capacitors, etc., can solve problems affecting the electrical characteristics of capacitors, etc.

Active Publication Date: 2022-07-22
ANDAQ TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the capacitors in the prior art will have a capacity loss of more than 10% when receiving a surge current, which will seriously affect the electrical characteristics of the capacitor, and there is still room for improvement.

Method used

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  • Capacitor, capacitor package structure and manufacturing method thereof
  • Capacitor, capacitor package structure and manufacturing method thereof
  • Capacitor, capacitor package structure and manufacturing method thereof

Examples

Experimental program
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no. 1 example

[0026] see figure 1 as well as figure 2 As shown, the present invention provides a capacitor 1, the capacitor 1 includes at least one conductive polymer material, and the at least one conductive polymer material is made from a solution containing a plurality of conductive polymer particles P. In addition, the particle size of the conductive polymer particles P can be at least less than (or not greater than) 30 nm, so that the capacitance decay generated when the capacitor 1 receives a surge current can be at least less than 10%. That is to say, since the particle size of the conductive polymer particles P can be at least less than 30 nm, when the capacitor 1 receives a surge current, the decay percentage of the capacitance generated by the capacitor 1 will be at least less than (or not more than) ) 10% and no more than 10%.

[0027] For example, combining figure 1 and figure 2 As shown, the capacitor 1 can be a stacked capacitor unit 11 , which includes a metal foil 110 ...

no. 2 example

[0036] see Figure 5 As shown, the present invention provides a capacitor 1, the capacitor 1 includes at least one conductive polymer material, and the at least one conductive polymer material is made from a solution containing a plurality of conductive polymer particles (not shown). In addition, the particle size of the conductive polymer particles can be at least less than 30 nm, so that the capacitance decay generated when the capacitor 1 receives a surge current can be at least less than 10%. That is to say, since the particle size of the conductive polymer particles can be at least less than 30 nm, when the capacitor 1 receives a surge current, the decay percentage of the capacitance generated by the capacitor 1 will be at least less than 10% and not greater than 10%. %.

[0037] For example, as Figure 5 As shown, the capacitor 1 may be a wound capacitor unit 12, and the wound capacitor unit 12 includes: a wound positive conductive foil 121, a wound negative conductive...

no. 3 example

[0041] see Figure 7 , and refer to Figure 1 to Figure 6 As shown, the third embodiment of the present invention provides a manufacturing method of a capacitor packaging structure, which includes: first, providing a conductive component 2 (S100); then, disposing at least one capacitor 1 on the conductive component 2, and the conductive component 2 Including at least one positive conductive pin 21 and at least one negative conductive pin 22 separated from the at least one positive conductive pin 21 (S102); then, forming an encapsulation structure 3 to cover all of the at least one capacitor 1 and the conductive components part of 2 (S104). For example, the plurality of conductive polymer particles P are synthesized into at least one conductive polymer material under the condition of introducing at least one oxidant, and the at least one oxidant can be oxygen, hydrogen peroxide or any oxygen-containing oxidant.

[0042] It should be noted that at least one capacitor 1 include...

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Abstract

The invention discloses a capacitor, a capacitor packaging structure and a manufacturing method thereof. Capacitors include conductive polymer materials. The conductive polymer material is made from a solution containing a plurality of conductive polymer particles. The particle size of the conductive polymer particles is at least less than 30 nm, so that the capacitance decay generated when the capacitor receives a surge current is at least less than 10%. In addition, the capacitor package structure includes a conductive polymer material. The conductive polymer material is made from a solution containing a plurality of conductive polymer particles. Thereby, since the particle size of the conductive polymer particles is at least less than 30 nm, the capacitance attenuation generated when the capacitor packaging structure receives the inrush current can be at least less than 10%.

Description

technical field [0001] The invention relates to a capacitor, a capacitor packaging structure and a manufacturing method thereof, in particular to a capacitor, a capacitor packaging structure and a manufacturing method with a capacitance attenuation of at least less than 10% when receiving a surge current. Background technique [0002] Capacitors have been widely used in consumer household appliances, computer motherboards and their peripherals, power supplies, communication products, and basic components of automobiles. Equality is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses, including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior frequency characteristics, and can be used for decoupling of power su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/042H01G9/08H01G9/15
CPCH01G9/0425H01G9/08H01G9/15H01G9/151
Inventor 吴家钰
Owner ANDAQ TECH CO LTD
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