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Wafer cleaning device and cleaning method

A technology for cleaning wafers and wafers, which is applied to cleaning methods and utensils, chemical instruments and methods, electrical components, etc., and can solve problems such as uneven cleaning

Pending Publication Date: 2020-03-24
SUMCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, with regard to the conventional cleaning method described in Patent Document 3, although it is possible to reduce the portion that becomes the shadow of the ultrasonic wave, it is not effective against the attenuation of the ultrasonic wave due to the distance from the ultrasonic oscillation source or the uneven liquid flow in the cleaning tank. Uneven cleaning within the wafer surface has no effect

Method used

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  • Wafer cleaning device and cleaning method
  • Wafer cleaning device and cleaning method
  • Wafer cleaning device and cleaning method

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Embodiment Construction

[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0040] figure 1 It is a schematic side sectional view showing the structure of the wafer cleaning apparatus according to the first embodiment of the present invention. and, figure 2 Yes figure 1 A schematic top view of the wafer cleaning apparatus.

[0041] like figure 1 and figure 2 As shown, the wafer cleaning device 10 is a batch-type device for cleaning and processing multiple wafers 1 at one time, and has: a cleaning tank 11 storing cleaning liquid 2; a support 12 keeping multiple wafers 1; A plurality of wafers 1; and the ultrasonic generator 14 is arranged below the cleaning tank 11.

[0042] The cleaning tank 11 is a container capable of accommodating a plurality of wafers 1 , and an opening 11 a serving as an entrance and exit for the wafer 1 is provided above. Furthermore, a cleaning solution recovery tank 15 is provided outside th...

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Abstract

The invention provides a wafer cleaning device which is not influenced by attenuation of ultrasonic waves or uneven liquid flow in a cleaning tank and can uniformly clean the inside of a wafer surfacewithout stains. The wafer cleaning device includes: a cleaning tank (11) filled with a cleaning liquid (2); a holder (12) that swingably holds the wafer (1) in the cleaning tank (11); and a wafer chuck (13) that holds and moves the wafer (1) in the vertical direction. When the wafer (1) is rotated, the wafer (1) is lifted by the wafer chuck (13) so that the wafer (1) floats from the holder (12) at a position where the swing angle of the holder (12) is-theta degrees. Next, the wafer (1) is rotated in the circumferential direction by rotating only the holder (12) at an angle of + theta and thenreleasing the wafer chuck (13) and placing the wafer (1) on the holder (12) again.

Description

technical field [0001] The present invention relates to a wafer cleaning device and a cleaning method, and more particularly to a wafer cleaning device and a cleaning method provided with a mechanism for preventing uneven cleaning of a wafer. Background technique [0002] A silicon wafer used for a semiconductor device is produced by chamfering, grinding, etching, or the like on a substantially disk-shaped wafer substrate sliced ​​from a silicon ingot. In these processing steps, particles such as abrasive dust are generated during wafer processing and adhere to the wafer, so it is necessary to use a wafer cleaning device to clean the wafer after processing. [0003] In a typical batch type wafer cleaning apparatus, a plurality of wafers are immersed in a cleaning tank filled with cleaning liquid for a certain period of time, and ultrasonic waves are generated from an ultrasonic generator in the cleaning tank to clean the surfaces of the wafers. At this time, it is important...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02B08B7/02
CPCH01L21/67017H01L21/02041B08B7/028B08B3/12
Inventor 松永祐平冲田宪治
Owner SUMCO CORP