OLED packaging structure and manufacturing method
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as poor waterproof and oxygen performance
Pending Publication Date: 2020-03-24
FUJIAN HUAJIACAI CO LTD
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Problems solved by technology
[0004] For this reason, it is necessary to provide an OLED packaging structure and manufacturing method to solve the cause of poor waterproof and oxygen performance, and water and oxygen enter the packaging structure
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[0065] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.
[0066] see Figure 1 to Figure 11 , the present embodiment provides an OLED encapsulation structure and a manufacturing method, the manufacturing method can be prepared on the cover glass 1 and the substrate glass 2, comprising the following steps: making the first groove 3; 2 with glass etchant to etch out the first groove 3, the structure is as figure 1 Shown, the depth H of the first groove 3 1 is 20um to 150um, and the width L is 150 to 800um. Depth H of the preferred first groove 3 1 100um. The present invention can make at least one first groove on the cover glass 1 and the substrate glass 2, and the position of the first groove 3 of the cover glass 1 corresponds to the position of the first groove 3 on the substrate glass 2...
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The invention provides an OLED packaging structure and a manufacturing method. The method comprises the following steps: etching first grooves in cover plate glass and substrate glass; depositing silicon nitride and silicon oxide in the first groove; etching the silicon nitride and the silicon oxide in the first groove to form a spiral wide-narrow multi-section second groove, and etching a third groove on one side of the silicon nitride; sequentially manufacturing a luminescent material and a first inorganic barrier layer on the substrate glass; filling the third groove with a drying material;coating UV glue at the position of the second groove; and the UV glue is cured through ultraviolet irradiation. The second groove similar to a spiral wide-narrow multi-section type groove is manufactured, on one hand, the firmness between the cover plate glass and the substrate glass after attachment can be enhanced, on the other hand, the length of a water and oxygen invasion channel is increased, and the water and oxygen prevention effect is better. And the obstruction of silicon nitride water and oxygen invasion also plays a certain role. The silicon oxide supports the upper silicon nitride layer and the lower silicon nitride layer and is prevented from falling off due to insufficient action strength between the silicon oxide and the side wall.
Description
technical field [0001] The invention relates to the field of OLED packaging, in particular to an OLED packaging structure and a manufacturing method. Background technique [0002] Organic Light Emitting Display (OLED) is considered one of the technologies with the most development potential in the display industry today, because of its high definition and high contrast, self-illumination, high luminous efficiency, short response time, and achievable There are many advantages such as flexible display and large-area full-color display, and various institutions and enterprises are constantly conducting in-depth research on its performance in various aspects. Among them, OLED components are very sensitive to water and oxygen in the environment, so the packaging performance is a very important key point. [0003] At present, the mainstream packaging methods on the market are divided into hard screen packaging and flexible packaging. Hard screen packaging can be mainly divided in...
Claims
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IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/84H10K50/844H10K71/00
Inventor 林志斌单勇
Owner FUJIAN HUAJIACAI CO LTD