Manufacturing method of solder resist translation film
A production method and solder mask technology, which are applied in the application of non-metallic protective layers, secondary processing of printed circuits, etc., to achieve the effects of improving production quality and production efficiency, reducing costs, and improving alignment accuracy.
Active Publication Date: 2020-03-24
DALIAN CHONGDA CIRCUIT
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Problems solved by technology
[0007] In order to solve the above-mentioned technical problems, the present invention provides a method for manufacturing a solder resist translational film. For a 1PNL production board including multiple SET groups and some of the SET groups have regular deformation and offset during solder resist, the The preparation method comprises the following steps:
Method used
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Experimental program
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Effect test
Embodiment
[0020] A method for manufacturing a circuit board shown in this embodiment includes the following processing steps in sequence:
[0021] (1) Cutting: The core board is cut out according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm (excluding the thickness of the outer copper layer), and the thickness of the copper layer on both surfaces of the core board is 0.5OZ.
[0022] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch out the inner layer circuit on the core board after exposure and development, and measure the inner layer line width to 3mil; inner layer AOI, and then check the open and short circuit of ...
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Abstract
The invention discloses a manufacturing method of a solder resist translation film. For a 1PNL production board comprising a plurality of SET groups and under the condition that regular deformation deviation exists when part of the SET groups are subjected to resistance welding, the manufacturing method comprises the following steps that the production board subjected to resistance welding deviation is collected, and the specific number and positions of the SET groups of the resistance welding deviation on the production board are obtained through inspection; detecting to obtain the offset direction and offset corresponding to the SET group of each solder mask offset; when an exposure film for solder resist is manufactured, solder resist patterns at the SET groups corresponding to the solder resist offsets in the exposure film translate according to the offset directions and offsets of the solder resist offsets. According to the method, the problem of solder mask deviation can be effectively solved, the production quality and the production efficiency of the circuit board are improved, and the cost can be effectively reduced.
Description
technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing a solder resist translational film. Background technique [0002] During the solder masking process of circuit board production, the problem of partial SET group solder mask deviation often occurs. The improvement methods for the regular deformation and deviation of incoming materials mainly include modifying and optimizing the stretch coefficient of the exposure film or manually cutting the film. Alignment or use LDI exposure machine to improve exposure accuracy and alignment to adjust, but the above methods have their own defects: [0003] 1. Optimizing the expansion and contraction coefficient of the exposure film will waste the cost of the film, and it still cannot solve the problem of partial SET deviation; [0004] 2. The manual cutting and alignment work is heavy, the efficiency is too slow and the accuracy is not hi...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/28
Inventor 王金龙黄国平郑威孙飞跃
Owner DALIAN CHONGDA CIRCUIT