Pretreatment method and device for circuit board heat dissipation ink

A technology of pretreatment device and circuit board, which is applied in transportation and packaging, foam dispersion/prevention, chemical instruments and methods, etc., can solve the problems of a large number of tiny bubbles, and the distribution of graphene is not uniform enough, so as to reduce production costs and eliminate the Bubble, simple structure effect

Pending Publication Date: 2020-03-27
珠海斗门超毅实业有限公司
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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the object of the present invention is to at least solve one of the technical problems existing in the prior art, and provide a pretreatment method for circuit

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  • Pretreatment method and device for circuit board heat dissipation ink
  • Pretreatment method and device for circuit board heat dissipation ink
  • Pretreatment method and device for circuit board heat dissipation ink

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[0025] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented in accordance with the content of the specification, and in order to make the above and other objectives, features and advantages of the present invention more obvious and understandable. In the following, the preferred embodiments are cited in conjunction with the drawings, and the detailed description is as follows.

[0026] Please refer to figure 1 , The pretreatment method of heat dissipation ink for circuit board disclosed in this embodiment includes the following steps:

[0027] S1. Pour the heat-curing graphene ink and defoamer into the mixing barrel in proportion, and add the defoamer when stirring the heat-curing graphene ink to help eliminate bubbles in the ink;

[0028] S2. Under the condition of rotation speed ≥1000 revolutions / min, shear the ink in the mixing tank, and ...

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Abstract

The invention discloses a pretreatment method and device for circuit board heat dissipation ink. The method comprises the steps: S1, thermosetting graphene ink and a defoaming agent are poured into astirring barrel in proportion; S2, the printing ink in the stirring barrel is subjected to shear type stirring under the condition that the rotating speed is larger than or equal to 1000 RPM, and thestirring time is larger than or equal to 10 min; and S3, the stirred ink is cooled to room temperature. The device comprises a support, a stirring motor arranged on the support, and a stirring barrelarranged below the support; the stirring motor is connected with a shearing type stirring head, and the rotating speed of the stirring motor is larger than or equal to 1000 RPM. According to the pretreatment method and device disclosed by the invention, the defoaming agent is added when the thermosetting graphene ink is stirred, elimination of bubbles in the ink can be facilitated, the thermosetting graphene ink is stirred at a high speed, graphene can be uniformly distributed in the ink, stirring can be performed in a non-vacuum environment, expensive vacuum stirring device is not needed, andreduction of the production cost can be facilitated.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a pretreatment method and device for heat dissipation ink of circuit boards. Background technique [0002] In circuit boards, the ink used in the solder mask layer (hereinafter referred to as ordinary ink) generally includes green oil, carbon oil and blue glue. For circuit boards with high heat dissipation performance requirements, the heat dissipation performance of ordinary inks cannot meet the heat dissipation requirements. [0003] Thermosetting graphene ink has better heat dissipation performance than ordinary ink. This ink has light printing pattern, good printing suitability, mild curing conditions, low cost, insulation and good operating characteristics. Using thermosetting graphite Graphene ink production circuit provides a new solution for the thermal management of printed circuit boards in the application process. [0004] Compared with ordinary inks, heat-cura...

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Application Information

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IPC IPC(8): B01F15/00B01F7/26B01F7/18B01D19/04B01F27/93
CPCB01D19/04B01F27/93B01F27/90B01F35/2111B01F35/2115B01F35/2117B01F35/2202B01F35/43B01F2101/35
Inventor 蔡松崎俞佩贤王睿刚刘长庆张宏图曾新华陈嘉文
Owner 珠海斗门超毅实业有限公司
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