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Heat dissipation assembly and charging module

A technology for heat dissipation components and radiators, which is applied in charging stations, electric vehicle charging technology, electric vehicles, etc., can solve problems such as affecting the service life, high-heating devices affecting the temperature rise of low-heating devices, etc.

Pending Publication Date: 2020-03-31
SICHUAN WEIYU ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Numerous high-heating components are installed nearby on the PCB board according to the principle of signal transmission, and the temperature rise of high-heating components directly affects the temperature rise of low-heating components, thus affecting their service life

Method used

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  • Heat dissipation assembly and charging module
  • Heat dissipation assembly and charging module
  • Heat dissipation assembly and charging module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The embodiment of the present invention provides a heat dissipation assembly, which can reduce the heat dissipation of low heat generating devices by separating the heat of high heat generating devices from low heat generating devices as much as possible and dissipating the heat of high heat generating devices to the surrounding environment as quickly as possible. The impact of the heating device, and further improve the environmental adaptability of the charging module, to achieve the purpose of prolonging the service life and reliability of the DC charging pile, thereby reducing the charging operation cost and reducing the driving cost of electric vehicles, which is conducive to promoting the rapid development of electric vehicles , specifically as figure 2 shown.

[0040] Heat dissipation components include radiators and power devices. The power device includes a magnetic element and a semiconductor switching device; the magnetic element includes one or more transf...

Embodiment 2

[0055] Such as Figure 2-Figure 6 As shown, a heat dissipation assembly, the structure is basically the same as that of Embodiment 1, the difference is that: the exposed live parts of the semiconductor switch device provided on the surface of the radiator are wrapped with three anti-paints, so that the live part of the semiconductor switch device has sufficient Insulation performance and moisture-proof and water-proof ability can effectively prevent various dust and moisture from causing short circuit or arcing of charged parts of semiconductor switching devices.

[0056] Due to the adoption of the above technical solution, the beneficial effect of a heat dissipation assembly of the present invention is that the three-proof performance is more superior, and the semiconductor switching device arranged on the surface of the radiator can be directly ventilated and radiated, which is beneficial to use in harsh environments.

Embodiment 3

[0058] Such as Figure 10 and Figure 11 As shown, the charging module includes a housing and at least one set of control units; it also includes at least one heat dissipation assembly as described in Embodiment 1-2; and the heat dissipation assembly is electrically and / or mechanically connected to the control unit.

[0059] Preferably, the heat dissipation assembly and the control unit are arranged in a stacked arrangement structure, and the components of the control unit and the magnetic components and semiconductor switching devices on the heat sink are arranged in partitions through the PCB board and / or heat insulating material, so that the components with large heat generation Magnetic components and semiconductor switching devices greatly reduce the influence of the components of the control unit with low heat generation; the stacked arrangement is conducive to the nearby connection between the components of the heat dissipation component and the circuits of the control ...

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PUM

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Abstract

The invention discloses a heat dissipation assembly and a charging module. The heat dissipation assembly comprises a radiator and a power device. The radiator is provided with a groove, and the powerdevice is arranged in the groove of the radiator and / or arranged on the surface of the radiator. And the radiator is also provided with radiating fins to form a radiating air duct. And air duct partition plates can be arranged on the other four surfaces of the radiator and the power device combination unit except the inlet surface and the outlet surface of the radiating air duct. And a heat dissipation fan is arranged on the inlet surface and / or the outlet surface of the heat dissipation air duct to blow and / or draft the heat dissipation air duct, so that the heat of the heat dissipater is quickly dissipated into the air. The heat dissipation assembly and the component electrified body are isolated from flowing heat dissipation air, dust, moisture, conductive dust, corrosive substances andthe like are prevented from entering electrified positions, the reliability and safety of products are improved, the heat dissipation assembly has the advantages of being small in size, good in heatdissipation effect, high in environmental adaptability and the like, the service life of the products is prolonged, and development of the electric automobile industry is accelerated.

Description

technical field [0001] The invention relates to the technical field of DC charging piles, in particular to a heat dissipation component and a charging module. Background technique [0002] As one of the most promising new energy vehicles, electric vehicles have been widely used and promoted. Charging pile technology is the key technology for the development of electric vehicles. Its efficiency, life span, charging reliability and stability, As well as the service life and environmental adaptability of charging piles, it affects the comprehensive indicators of the cost of electric vehicles, and even affects the application and development of electric vehicles. [0003] The current charging module is composed of various electronic components that are electrically connected through PCB board wiring and various cables, and are collectively arranged in the same housing, and a fan is used to directly dissipate heat from the heating device. According to the principle of signal tra...

Claims

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Application Information

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IPC IPC(8): B60L53/31B60L53/302
CPCB60L53/302B60L53/31Y02T10/70Y02T10/7072Y02T90/12
Inventor 刘少德王军陈晓法
Owner SICHUAN WEIYU ELECTRIC CO LTD