Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of step groove manufacturing method and pcb

A manufacturing method and stepped groove technology, which are applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, printed circuit, etc., can solve the problems of complicated manufacturing process and difficult manufacturing

Active Publication Date: 2021-04-09
DONGGUAN SHENGYI ELECTRONICS
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a step groove manufacturing method and PCB, which overcome the defects of complex manufacturing process and difficult manufacturing in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of step groove manufacturing method and pcb
  • A kind of step groove manufacturing method and pcb
  • A kind of step groove manufacturing method and pcb

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] see figure 1 and figure 2 , the manufacturing method of the step groove proposed in this embodiment is suitable for making a step groove with non-metallized side walls, and specifically includes the following steps:

[0036] Step 101, making a pressing mold, the pressing mold includes a body and a punch 10 arranged on the body, the punch 10 includes a pressing surface, and the pressing surface includes a first concave surface 11 and a first convex surface 12 that are relatively concavo-convex, The first concave surface 11 is formed in a first prescribed figure.

[0037] In the subsequent pressing process to form the circuit pattern at the bottom of the groove, the punch 10 will be used to extend into the stepped groove and contact the bottom surface of the groove to generate pressure. Based on this, the pressing surface specifically refers to: after the punch 10 is inserted into the stepped groove, the surface of the punch 10 facing the bottom area of ​​the groove. ...

Embodiment 2

[0054] On the basis of Example 1, please refer to image 3 and Figure 4 , the present embodiment 2 provides another step groove manufacturing method to make a step groove with side wall metallization, which specifically includes the following steps:

[0055] Step 201, making a pressing mold, the pressing mold includes a body and a punch 10 arranged on the body, the punch 10 includes a pressing surface and a side wall, and the pressing surface includes a first concave surface 11 and a first The convex surface 12 and the first concave surface 11 are formed in a first designated pattern, and the side walls are planar structures.

[0056] The overall size of the punch 10 is slightly smaller than the internal size of the stepped groove to be made, so that when the punch 10 is placed in the stepped groove 20 and the first convex surface 12 of the pressing surface of the punch 10 abuts against the bottom area of ​​the groove, the first concave surface 11 and the groove bottom area...

Embodiment 3

[0065] On the basis of Example 1, please refer to Figure 5 and Figure 6 , the third embodiment provides another step groove manufacturing method to make a side wall metallized step groove, which specifically includes the following steps:

[0066] Step 301, making a pressing mold, the pressing mold includes a body and a punch 10 disposed on the body, the punch 10 includes a pressing surface, and the pressing surface includes a first concave surface 11 and a first convex surface 12 that are relatively concavo-convex, The first concave surface 11 is formed in a first prescribed figure. The punch 10 also includes a side wall, the side wall includes a second concave surface 13 and a second convex surface 14 arranged opposite to each other, and the second concave surface 13 is formed into a second specified pattern.

[0067] The size of the punch 10 is basically the same as the internal size of the stepped groove to be made, so that when the punch 10 is inserted into the stepped...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of PCB, and discloses a method for manufacturing a stepped groove and a PCB. The method includes: making a stepped groove with non-metallized side walls and groove bottom regions; coating conductive glue on the groove bottom region; obtaining a pressing mold, including a punch, the punch includes a pressing surface, and the pressing surface includes The first convex surface set relative to the concave and convex and the first concave surface in the first designated figure, the first designated figure is consistent with the preset groove bottom circuit pattern; the stepped groove is placed in the punch and the groove bottom area of ​​the first convex surface and the stepped groove When abutting against each other, a first gap is formed between the first concave surface and the bottom area of ​​the groove; the punch and the stepped groove are pressed together at high temperature, so that the conductive glue flows into the first gap and solidifies, forming a circuit pattern at the bottom of the groove. In the embodiment of the present invention, first coat the conductive adhesive with a specified thickness on the bottom of the groove, and then use a special pressing mold to put it into the groove and press it, so that the required circuit pattern at the bottom of the groove can be obtained, which greatly simplifies the manufacturing process and reduces the production cost. Difficulty, effectively improving production efficiency.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a stepped groove and a PCB. Background technique [0002] Due to its special structure and electrical properties, the stepped groove has a wide range of applications in three-dimensional three-dimensional assembly, reducing the assembly volume of electrical equipment, and special electrical properties. [0003] At present, there are various methods of manufacturing printed circuit boards, but for stepped grooves with non-metallized side walls, the usual manufacturing method is: first make groove bottom graphics on the core board / sub-board at the bottom of the groove, and then make Ladder slot. This manufacturing method has the following defects: since the groove bottom pattern is made first, the groove bottom pattern needs to be protected before the subsequent step groove is made, resulting in a long and compl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/40H05K3/46
CPCH05K1/119H05K3/403H05K3/46H05K2201/09645H05K2201/09845
Inventor 刘梦茹纪成光陈正清
Owner DONGGUAN SHENGYI ELECTRONICS