A method suitable for airtight laser sealing welding of silicon-aluminum alloy boxes

A silicon-aluminum alloy, laser welding technology, applied in laser welding equipment, welding equipment, welding equipment and other directions, can solve problems such as thermal stress cracks, cumbersome, not considering size matching, etc., to achieve improved reliability and ensure air tightness performance and long-term reliability, penetration more consistent results

Active Publication Date: 2021-08-17
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Claims
  • Application Information

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Problems solved by technology

However, it does not take into account the influence of parameters related to the sealing effect, such as the size of the laser spot, the size of the cover plate and the box body, the welding trajectory, the laser peak value, etc., and it is cumbersome to control the laser power change through the number of waveforms. Moreover, there is a sudden change between the waveform switching, which still brings potential risks of thermal stress cracks to the brittle silicon-aluminum box.

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  • A method suitable for airtight laser sealing welding of silicon-aluminum alloy boxes
  • A method suitable for airtight laser sealing welding of silicon-aluminum alloy boxes
  • A method suitable for airtight laser sealing welding of silicon-aluminum alloy boxes

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[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the invention. It may be evident, however, that one or more embodiments may be practiced without these specific details. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0035] The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the invention. The terms "comprising", "comprising", etc. used herein indicate the presence of stated features, steps, operations and / ...

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Abstract

The invention provides a method suitable for airtight laser sealing welding of silicon-aluminum alloy boxes. The method includes: Step 1, using a laser with a spot size of 0.3-0.6mm, and the laser spot waveform is rising-flat ‑Descent trapezoidal spot waveform; Step 2, set the width A of the welding surface, the welding gap B, the thickness C of the cover plate, and the lap width D of the cover plate as preset values; Step 3, apply pressure to the cover plate, and Spot welding the cover plate and the box body; step 4, combining steps 1 and 2, laser welding the cover plate and the box body along the preset welding track. The invention effectively avoids thermal stress cracks in welding, and avoids problems such as cover plate warping due to excessive local thermal stress during laser welding.

Description

technical field [0001] The invention relates to a method suitable for airtight laser sealing welding of a silicon-aluminum alloy box body. Background technique [0002] Microwave components, as the core components of active phased array antennas, have developed rapidly in recent years. In order to further improve the integration density and reliability of microwave components, multilayer ceramic substrates represented by LTCC are more and more widely used in microwave components. Aluminum alloy materials are difficult to apply due to the mismatch of thermal expansion coefficients with ceramic substrates. With its low density, low thermal expansion coefficient, high thermal conductivity, good machining performance and many other advantages, silicon-aluminum alloy can meet the needs of the current aerospace microwave components for shell materials. In order to ensure the long-term stable operation of the components, it is usually necessary to realize the hermetic packaging o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/24B23K26/40B23K26/70B23K37/04
CPCB23K26/24B23K26/40B23K37/0443B23K26/702
Inventor 王松陈萍贺颖史戈
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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