Unlock instant, AI-driven research and patent intelligence for your innovation.

A fixed-point tin-plating filling device for circuit board production

A filling device and circuit board technology, applied in printed circuit, printed circuit manufacturing, electrolytic components, etc., can solve the problems of quantitative filling, excessive tin plating, too little tinning, etc., to facilitate observation and judgment, avoid circuit damage, and protect the circuit Effect

Active Publication Date: 2021-06-25
ANHUI LINCHI ELECTRONICS CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art, the present invention provides a fixed-point tin-plating filling device for circuit board production, which has the advantages of quantitative filling and can fix circuit boards of different sizes, and solves the problem of the current fixed-point tin-plating filling device for circuit boards. It cannot be filled quantitatively, which will easily lead to excessive or too little tin plating, and cannot fix circuit boards of different sizes, which is not convenient for people to use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A fixed-point tin-plating filling device for circuit board production
  • A fixed-point tin-plating filling device for circuit board production
  • A fixed-point tin-plating filling device for circuit board production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and components will be shown in a simple schematic manner in the drawings.

[0019] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and do not refer to the meaning of order or sequence, nor are they used to limit the present invention, but are only for the purpose of distinguishing the following The components or operations described by the same technical terms are only used, but should not be understood a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit board production, and specifically discloses a fixed-point tinning and filling device for circuit board production, which includes a workbench and a box body. Support columns are fixedly connected around the top of the workbench. The top is fixedly connected with a top plate, the front and rear ends of the bottom of the top plate are fixedly installed with guide rails, the surface of the guide rails is equipped with an electric slide table, and the bottom of the electric slide table is fixedly installed with an electric telescopic rod, and the electric telescopic rod The bottom is fixedly mounted with a tinned head. The present invention cooperates with each other through the left splint, electric telescopic rod, guide rail, electric sliding table, pump machine, motor, right splint, tinning head, groove, threaded rod, chute, slider, threaded sleeve and liquid level sensor to solve the problem of The current circuit board fixed-point tin-plating filling device cannot be filled quantitatively, which may easily lead to excessive or too little tin plating, and cannot fix circuit boards of different sizes, which is not convenient for people to use.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a fixed-point tin-plating filling device for circuit board production. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board and printed (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, It plays an important role in mass production of fixed circuits and optimization of electrical layout. Circuit boards can be called printed circuit boards or printed circuit boards. The circuit boards need to be tinned during the production process, but the current fixed-point tinning filling device for circuit boards cannot be filled quantitatively. , it is easy to cause excessive or too little tin plating, and it cannot fix circuit boards of different sizes, which is not convenient for p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D19/00C25D5/04C25D5/02C25D21/12H05K3/00
CPCC25D5/02C25D5/04C25D21/12H05K3/00
Inventor 李涛吕涛有
Owner ANHUI LINCHI ELECTRONICS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com