A semiconductor wafer surface impurity removal equipment and its operating method

Abstract

The invention discloses a semiconductor wafer surface impurity removal device, which comprises a cleaning tank, a water outlet pipe is arranged in the middle of the bottom surface of the cleaning tank, a water storage tank is arranged under the bottom surface of the cleaning tank, a water pump is arranged at one end of the top surface of the water storage tank, and the water outlet of the water pump is fixed. Connected with a water supply pipe, a fixed plate is provided above the top surface of the cleaning tank, and two electric push rods, a hot air blower, a water spray pipe and an air spray pipe are provided on the bottom surface of the fixed plate, and a waterproof motor is provided at the movable end of each electric push rod. The motor shaft of each waterproof motor is fixedly connected with a connecting column. There is a support frame above the bottom surface of the cleaning tank. The four corners of the top surface of the support frame are fixed with limit rods. The middle part of the rod is fixedly connected with connecting rods, and the other end of each connecting rod is fixedly connected with the corresponding connecting column, and the lower end of one side of the cleaning tank is provided with a power supply box. The invention can clean and dry semiconductor wafers in batches, which is beneficial to improve operation efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a semiconductor wafer surface impurity removal equipment and an operation method thereof. Background technique [0002] If the semiconductor wafer is polluted by dust particles and metals during the production process, it is easy to cause damage to the circuit function in the wafer, form a short circuit or open circuit, etc., resulting in the failure of the integrated circuit and affecting the formation of geometric features. Therefore, in addition to eliminating external pollution sources during the production process, cleaning work is also required to effectively use chemical solutions or gases to remove dust remaining on the wafer without damaging the surface and electrical properties of the wafer. , metal ions and organic matter and other impurities. [0003] In the prior art, the wafer is usually put into a cleaning tank filled with deionized wate...

AI Technical Summary

Problems solved by technology

A lot of time will be wasted in the process of cleaning the wafer and waiting for drying, which is not conducive to improving work efficiency, and there is a small amount of deionized water remaining on the surface of the wafer. Since the residual deionized water droplets have a certain surface tension, it may damage the wafer. Various special structures on the surface cause damage and affect wafer quality

Images