Surface acoustic wave module one-step molded packaging structure and packaging process thereof

Abstract

The invention discloses a surface acoustic wave module one-time formed packaging structure and a packaging process thereof. According to the packaging structure, a surface acoustic wave bare chip, anactive device and a passive device are arranged on a laminated board, and a via hole is formed in the laminated board to be connected with a ground PAD; a thin film and a metal coating are sequentially arranged on the mounting surface of each device, wherein the metal coating is connected with the ground pad on the front face and the ground PAD on the back face through via holes, and an EMC layeris packaged on the periphery of the metal coating. The packaging process comprises the following steps: mounting each device on the laminated board; covering the mounting surface of each device with the thin film for curing; then removing the thin film on the surface of the grounding PAD through laser equipment, and setting a metal plating layer to enable the metal plating layer to be conducted with the grounding PAD; and finally filling the EMC layer. According to the invention, the shielding area can be flexibly created, the packaging size is reduced, and the heat dissipation is better through the shielding layer; and compared with the traditional process, the process enables the metal shielding layer to be protected inside, so the reliability is better, the shielding effect is good, andthe overall performance is better.

Description

technical field [0001] The invention relates to a package structure of a filter and a package process thereof, in particular to a package structure of a surface acoustic wave module formed at one time and a package process thereof. Background technique [0002] At present, surface acoustic wave filters have high requirements on the cleanliness of the working surface. Usually, the bare chip is packaged separately, but the function of a single chip is single, which cannot meet the requirements of high integration of modern electronic products, and often needs to be combined with other functional devices. Perform secondary packaging, but this increases the volume of the integrated module, which is contrary to the concept of miniaturization. At the same time, the shielding of the surface acoustic filter is very important to its performance. If there is signal interference, it will have a great impact on the filtering effect. The current packaging is injection molded, and then ni...

AI Technical Summary

Problems solved by technology

[0002] At present, surface acoustic wave filters have high requirements on the cleanliness of the working surface. Usually, the bare chip is packaged separately, but the function of a single chip is single, which cannot meet the requirements of high integration of modern electronic products, and often needs to be combined with other functional devices. Perform secondary packaging, but this increases the volume of the integrated module, which is contrary to the concept of miniaturization

At the same time, the shielding of the surface acoustic filter is very important to its performance. If there is signal interference, it will have a great impact on the filtering effect. The current packaging is injection molded, and then nickel-plated to achieve shielding. The metal shielding layer is located on the device. The outermost layer, in the subsequent assembly process, may damage the metal layer, thereby affecting the shielding effect

And it can only satisfy the isolation inside and outside the module. In fact, due to the high integration of the module, the number and functions of the components inside the module are increasing, and they will also interfere with each other, affecting performance.

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