Unlock instant, AI-driven research and patent intelligence for your innovation.

A positioning method for grasping a PCB board and a device for removing glue from positioning holes of the PCB board

A PCB board and positioning hole technology, which is applied to the positioning of circuit board tools, printed circuits, electrical components, etc., can solve the problems of high processing costs, low utilization rate of cutting boards, and large positioning errors, so as to improve utilization rate and save labor , the effect of reducing production costs

Active Publication Date: 2021-10-12
WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a positioning method for grabbing PCB boards and a glue removal device for positioning holes of PCB boards, so as to solve the technical problems of large positioning errors in the glue removal process, low utilization rate of cutting boards, and high processing costs in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A positioning method for grasping a PCB board and a device for removing glue from positioning holes of the PCB board
  • A positioning method for grasping a PCB board and a device for removing glue from positioning holes of the PCB board
  • A positioning method for grasping a PCB board and a device for removing glue from positioning holes of the PCB board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as Figure 1~Figure 3 As shown, a positioning method for grabbing a PCB board. After the PCB board 1 is driven by the roller 21 of the conveying device and moves to the top of the light source 25 along the conveying device, it is detected by the infrared sensing device 24 arranged on the conveying device. The infrared sensing device 24 controls the roller 21 to stop its rotation, the PCB board 1 stops moving after touching the first stopper 23, and the second stopper 22 adjusts the PCB board 1 so that it is centered on the side. The light source 25 adopts an incandescent lamp and is arranged on the conveying device. The light source 25 illuminates the back of the PCB 1 and transmits light upward through the positioning holes on the PCB 1 . The first suction cup 311 is arranged on the first mechanical arm 31, and the CCD imaging device 4 is arranged on the first suction cup 311. The first mechanical arm 31 moves the CCD imaging device 4 on the first suction cup 311 ...

Embodiment 2

[0030] Such as Figure 4 , Figure 5 As shown, based on the positioning method for grabbing PCB boards in Embodiment 1, the present invention provides a positioning hole glue removal device for PCB boards, including: a light source 25, a CCD imaging device 4, a first mechanical arm 31, and a second mechanical arm 32. The first milling machine 51 and the second milling machine 52, the light source 25 is set on the conveying device, the PCB board 1 moves to the top of the light source 25 driven by the roller 21 of the conveying device, the first stopper 23 and the second The second stopper 22 cooperates to position the PCB board sideways and center, the first suction cup 311 is arranged on the first mechanical arm 31 , and the CCD imaging device 4 is arranged on the first suction cup 311 . The method and working process of the first mechanical arm 31 driving the first suction cup 311 to grab the PCB board 1 from the conveying device are the same as those in the first embodiment...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a positioning method for grasping a PCB board and a positioning hole degluing device for a PCB board in the technical field of degumming of PCB boards, aiming to solve the problem of large positioning errors in the degumming process in the prior art and low utilization rate of cutting boards. The technical problem of high processing cost, the light source illuminates the back of the PCB board; collect the light transmitted through different positioning holes on the PCB board on the front of the PCB board, and obtain the center position of each positioning hole; according to the center position of each positioning hole The position calculates the center position of the PCB board, and transmits the center position of the PCB board to the first robot arm; the first robot arm aligns the center of the first suction cup with the center of the PCB board and grabs the PCB board. Then the PCB board is placed on the horizontal platform by the mechanical arm, and finally the milling device performs precise milling and deglue on the positioning holes of the PCB board. This method can automatically and effectively identify the position of the positioning hole, and accurately remove the residual resin on the positioning hole. It can be used for various sizes of operations, and can effectively improve the utilization rate of cutting boards and the processing efficiency of multilayer printed circuit boards.

Description

technical field [0001] The invention belongs to the technical field of glue removal for PCB boards, and in particular relates to a positioning method for grabbing a PCB board and a glue removal device for a positioning hole of a PCB board. Background technique [0002] The existing lamination technology of high-end boards (14-58 layers) generally uses PIN nails for lamination and positioning. After lamination, resin flows out along the gap between the positioning holes and PIN nails, and glue residue adheres to the positioning On the hole; the current method for cleaning the residual glue on the positioning hole is to use a traditional milling machine to mill the hole. [0003] When the traditional milling machine is actually milling the hole, the personnel manually take the board, put the board on the table of the milling machine, use the visual rearward displacement method to align the bottom of the milling cutter, and use the time of the foot to control the milling hole u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0044H05K2203/166
Inventor 张涛
Owner WUS PRINTED CIRCUIT (KUNSHAN) CO LTD