Production method of metalized blind groove local thick copper PCB

Abstract

The invention discloses a production method of a metalized blind groove local thick copper PCB. The method comprises the following steps of cutting, inner layer line printing, AOI detection, browning,board pressing, edge milling, targeting, drilling, depth-controlled groove milling, copper plate sinking and electroplating, outer layer dry film pasting, pattern electroplating, blue adhesive tape pressing, laser tin burning, first outer layer etching, adhesive tape tearing, film stripping, second outer layer etching, tin stripping, AOI and subsequent processes. According to the method, by designing a secondary dry film, partitioned etching is carried out according to a local bottom copper thickness difference, + / -20% control over the outer layer etching line width precision can be achieved,and normal manufacturing of products with the local thick bottom copper thickness difference larger than 10 OZ is achieved; after a blind groove is metalized, laser tin burning is adopted, and the groove bottom pattern circuit manufacturing is achieved. The production process flow is simple, the design is reasonable, and the batch production of the product type can be realized.

Description

technical field [0001] The invention belongs to the field of special process production and manufacture of PCB boards, and in particular relates to the design of a special process flow design and production process method selection of blind groove local thick copper. Background technique [0002] In the etching process of the outer layer of the PCB, due to the inconsistent thickness of the bottom copper, the etching speed is too fast or too slow, which will lead to a short circuit of the residual copper of the outer layer pattern or a thin over-etched line of the local circuit. When the local copper thickness difference is too large (>10OZ), it is impossible to control the line width accuracy of the outer layer by adjusting the etching parameters and designing compensation. One-time etching can no longer meet production requirements, and outer layer etching cannot guarantee product quality. In addition, after blind groove control deep milling, there is a difference in he...

AI Technical Summary

Problems solved by technology

One-time etching can no longer meet production requirements, and outer layer etching cannot guarantee product quality

In addition, after blind groove control deep milling, there is a difference in height on the surface of the board. After the groove wall is metallized, graphic lines need to be made at the bottom of the groove, which cannot be achieved by pasting dry film.

This special process thick copper plate has certain production difficulties, and it is necessary to develop a new production process and corresponding process flow to realize product production

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