Parallel seam welding packaging dot frequency source assembly and manufacturing method thereof

Abstract

The invention relates to the field of radio electronic circuits and particularly relates to a parallel seam welding packaging dot frequency source assembly which comprises a shell, a circuit board anda packaging cover. A supporting column is arranged in an inner cavity of the shell; a wire lead-out hole is formed in a bottom surface of an inner cavity of the shell, and an insulator is used for fixing a lead pin penetrating through the wire lead-out hole; the circuit board is provided with a circuit lead-out hole corresponding to a lead shell lead-out hole; a dot frequency source device is welded in a circuit of the circuit board; the circuit board is embedded into the inner cavity of the shell, the circuit board is supported through the supporting column, and the lead pin and the circuitlead-out hole are connected by soldering tin; the circuit board is fixed in the inner cavity of the shell by adopting an edge exposed copper bonding pad; the size and the shape of the packaging coverare the same as those of the shell, the packaging cover covers a notch of the shell, and soldering tin is adopted for packaging. By manufacturing the metal shell, a circuit board assembly can be effectively protected, the impact resistance, the vibration resistance, the salt mist resistance and the mold resistance of the assembly are improved, and the environmental adaptability of the assembly isimproved.

Description

technical field [0001] The invention relates to the field of radio electronic circuits, in particular to a parallel seam welding packaged point frequency source assembly and a manufacturing method thereof. Background technique [0002] The frequency source is a very important part of the radio electronic system. It provides a stable frequency signal for the entire system. There are many types of frequency sources, and the point frequency source is one of them, which can provide frequency signals at one or more fixed frequency points. In order to meet the frequency point signal required by the system, most of the point frequency sources at home and abroad are synthetic point frequency sources. Commonly used frequency synthesis methods are divided into direct analog synthesis, direct digital synthesis, indirect analog synthesis, and indirect digital synthesis. The basic circuit principles are different, and the final component indicators are also different. [0003] There are...

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Problems solved by technology

[0004] However, when low-temperature co-fired ceramic (LTCC) technology is used for packaging, the design cycle is long and the production cost is high; although components made of PCB boards are in the microwave and millimeter wave bands, their high-frequency characteristics are limited

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