Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Parallel seam welding packaging dot frequency source assembly and manufacturing method thereof

A parallel seam welding and component technology, applied in electrical components, sealed enclosures, circuit devices, etc., can solve the problems of high production cost, high frequency characteristics limitation, long design cycle, etc., to improve impact resistance, shield electromagnetic interference, improve The effect of electrostatic protection ability

Active Publication Date: 2020-04-17
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
View PDF26 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when low-temperature co-fired ceramic (LTCC) technology is used for packaging, the design cycle is long and the production cost is high; although components made of PCB boards are in the microwave and millimeter wave bands, their high-frequency characteristics are limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Parallel seam welding packaging dot frequency source assembly and manufacturing method thereof
  • Parallel seam welding packaging dot frequency source assembly and manufacturing method thereof
  • Parallel seam welding packaging dot frequency source assembly and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] A parallel seam welding package point frequency source assembly, such as figure 1 As shown, it includes a housing 1, a circuit board 2 and a package cover 3; the inner cavity of the housing 1 is provided with a pillar 14; Pin 12 is fixed;

[0035] Such as figure 2 As shown, the circuit board 2 is provided with a circuit lead-out hole 22 corresponding to the wire shell lead-out hole 11; a frequency source device is welded in the circuit of the circuit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of radio electronic circuits and particularly relates to a parallel seam welding packaging dot frequency source assembly which comprises a shell, a circuit board anda packaging cover. A supporting column is arranged in an inner cavity of the shell; a wire lead-out hole is formed in a bottom surface of an inner cavity of the shell, and an insulator is used for fixing a lead pin penetrating through the wire lead-out hole; the circuit board is provided with a circuit lead-out hole corresponding to a lead shell lead-out hole; a dot frequency source device is welded in a circuit of the circuit board; the circuit board is embedded into the inner cavity of the shell, the circuit board is supported through the supporting column, and the lead pin and the circuitlead-out hole are connected by soldering tin; the circuit board is fixed in the inner cavity of the shell by adopting an edge exposed copper bonding pad; the size and the shape of the packaging coverare the same as those of the shell, the packaging cover covers a notch of the shell, and soldering tin is adopted for packaging. By manufacturing the metal shell, a circuit board assembly can be effectively protected, the impact resistance, the vibration resistance, the salt mist resistance and the mold resistance of the assembly are improved, and the environmental adaptability of the assembly isimproved.

Description

technical field [0001] The invention relates to the field of radio electronic circuits, in particular to a parallel seam welding packaged point frequency source assembly and a manufacturing method thereof. Background technique [0002] The frequency source is a very important part of the radio electronic system. It provides a stable frequency signal for the entire system. There are many types of frequency sources, and the point frequency source is one of them, which can provide frequency signals at one or more fixed frequency points. In order to meet the frequency point signal required by the system, most of the point frequency sources at home and abroad are synthetic point frequency sources. Commonly used frequency synthesis methods are divided into direct analog synthesis, direct digital synthesis, indirect analog synthesis, and indirect digital synthesis. The basic circuit principles are different, and the final component indicators are also different. [0003] There are...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K5/06H05K1/18H05K1/11H05K1/02H05K3/00H05K3/34
CPCH05K1/0218H05K1/0224H05K1/115H05K1/18H05K3/00H05K3/34H05K5/0217H05K5/0247H05K5/06H05K2201/0715
Inventor 曾铮成精折刘星张广涵禹和平王树升
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com