Product cleaning process for digitally cleaning chip wafers

Abstract

The invention provides a product cleaning process for digitally cleaning chip wafers. The product cleaning process for digitally cleaning the chip wafers comprises the following steps that: S1, equipment is started, a system is automatically vacuumized, so that the chip wafer is made to be in a vacuum environment in the product cleaning process for digitally cleaning the chip wafer, and the systemcarries out automatic chemical liquid proportioning according to the cleaning requirement of the chip wafer; S2, a manipulator automatically grabs an iron sheet attached to the wafer and moves the iron sheet a cleaning station, the cleaning station rotates, and the wafer is brushed while a chemical proportioned liquid is sprayed to the wafer; S3, the spraying the chemical proportioned liquid is stopped, a two-fluid flow is introduced to wash the wafer; S4, the supply of the two-fluid flow is cut off, the wafer is dried and baked by utilizing the supply of hot nitrogen; S5, the wafer dried andbaked in the step S4 is transferred to a visual inspection station so as to be subjected to visual inspection, and whether the wafer is a qualified product or not is determined; and S6, if the waferis a qualified product, the cleaning process is terminated, and the material is conveyed out through a material conveying-out mechanism until the cleaning process is ended. With the product cleaning process adopted, automatic cleaning can be conducted, and a cleaning effect is improved.

Description

technical field [0001] The invention relates to the technical field of chip wafer cleaning equipment, in particular to a product cleaning process for digital cleaning of chip wafers. Background technique [0002] At present, the cleaning of chip wafers on the market mainly uses manual proportioning of the chemical solution, and then uses the method of soaking in the chemical solution, ordinary drying, and additional baking to clean the chip wafer. Although the process is simple, there are many problems. First, Difficult to digitize the ratio of the chemical solution has a great quality risk to the product quality; secondly, it is difficult to meet the cleaning requirements of the chip wafer during the soaking process, and the residual chemical solution and the damage to the product are serious; thirdly, the chemical solution cleaning There is a risk of secondary pollution to the chip wafer in the groove; the chip wafer after cleaning cannot guarantee the drying of water and ...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a product cleaning process for digital cleaning of chip wafers to solve the technical problems of chip wafer cleaning quality, efficiency, yield rate, labor time-consuming, high resources and costs in traditional cleaning processes