Semiconductor diffusion equipment and cooling rate adjusting method thereof

Abstract

The invention provides semiconductor diffusion equipment. The semiconductor diffusion equipment comprises a diffusion furnace body, a heating device and a plurality of cooling devices, wherein the diffusion furnace body is used for accommodating a wafer boat for bearing wafers, one end of a furnace tube is closed, the other end is provided with a loading-unloading port, the heating device surrounds the diffusion furnace body and is used for heating the diffusion furnace body, the interior of the heating device is divided into multiple heating regions from top to bottom, and a plurality of cooling devices are positioned on the heating device, are in one-to-one correspondence with a plurality of heating regions, and are used for performing adjustable cooling of the corresponding heating regions. The semiconductor diffusion equipment is advantaged in that the cooling rates of different regions can be adjusted, the cooling rates of different regions are consistent, so the temperatures of all the wafers finally moved from the diffusion furnace body to the room temperature environment are consistent, device failure on the wafers caused by thermal damage due to temperature difference is avoided, moreover, temperature management of subsequent processes is facilitated, and the production yield is increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor diffusion device and a method for adjusting the cooling rate thereof. Background technique [0002] The diffusion process is the most important doping process in integrated circuit manufacturing. It diffuses phosphorus, boron and other atoms into the wafer under high temperature conditions, thereby changing and controlling the type, concentration and distribution of impurities in the semiconductor, so as to establish regions of different electrical properties. Most of the existing diffusion processes are carried out in batch mode, that is, hundreds or even hundreds of wafers in multiple batches are put into the diffusion furnace at the same time for diffusion treatment, which can greatly improve the Productivity. However, the potential risk is that once the equipment fails or the process is abnormal, the number of affected wafers will also increase exp...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a semiconductor diffusion equipment and its cooling rate adjustment method, which is used to solve the problem in the prior art that after the diffusion process is completed, the cooling rates in different regions are different. It leads to prominent thermal damage, causes device failure on the wafer, and has adverse effects on subsequent processes, etc.

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