Joined component
A technology for joining components and parts, applied in electrical components, welding equipment, semiconductor devices, etc., can solve the problems of deepening corrosion, adverse effects on product functions, handling fluid distribution direction and uneven density, etc., to achieve the effect of ensuring interaction
Pending Publication Date: 2020-05-01
安范模
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Problems solved by technology
Therefore, there is a problem of dealing with fluid distribution direction and uneven density
In other words, there is a problem that, in the case where the fluid-permeable member is affected by the temperature in the process chamber, the product is deformed, which adversely affects the function of the product
[0012] However, the above-mentioned background art is a method of performing welding or joining in a molten state using a metal filler material (for example, filler metal in the case of welding), and therefore there is a problem that the processing fluid is injected through the hole 4. In this case, the metal filler material of the weld or joint 3 as the weld or joint is exposed to the treatment fluid and the corrosion deepens
Specifically, the background art is in a state in which the welded portion or the joint portion 3 is also present on the inner wall of the hole 4, so there is a problem that the welded portion or the joint portion 3 is exposed due to the treatment fluid passing through the inner wall of the hole 4, and corrosion occurs.
[0013] Such a problem is transmitted to the temperature regulation space such as the groove 2 through the welded part or the joint part 3 as the interface between the parts to be bonded 1 to adversely affect the temperature regulation space.
As a result, severe functional errors can result in temperature-regulated spaces
In the case of a functional error in the temperature adjustment space, there will be problems such as: the temperature of the fluid passing part becomes uneven and the position of the hole 4 is deformed, and the product itself is deformed
[0014] As described above, according to the technology that becomes the background of the idea of the present invention, the existing fusion bonding method has disadvantages that cause various problems
Method used
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[0046] The following merely illustrates the principles of the invention. Therefore, although not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, it should be understood that all conditional terms and examples listed in this specification are only for clearly understanding the concept of the invention in principle, and are not limited to such specifically listed examples and states.
[0047] The above-mentioned purpose, features, and advantages will become more apparent from the following detailed description related to the accompanying drawings, so those skilled in the art to which the invention pertains can easily implement the technical idea of the invention.
[0048] Embodiments described in this specification will be described with reference to cross-sectional views and / or perspective views which are id...
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The invention relates to a joined component that is formed by joining parent members by friction stir welding.
Description
technical field [0001] The present invention relates to a joining part welded by friction stir welding through which a processing fluid for a semiconductor process or a process fluid for a display process passes. Background technique [0002] As a technique for depositing a thin film on a semiconductor substrate or glass, chemical vapor deposition (Chemical Vapor Deposition, CVD) or atomic layer deposition (Atomic Layer Deposition, ALD) for depositing by chemical reaction is used. [0003] Equipment that performs thin film deposition like this chemical vapor deposition or atomic layer deposition or the like is used to manufacture semiconductor elements. In such thin film deposition equipment, a shower head is mainly provided in a chamber in order to supply a reaction process fluid required for depositing a thin film on a wafer. The shower head functions to spray the reactive process fluid onto the wafer in the proper distribution required for thin film deposition. [0004]...
Claims
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IPC IPC(8): H01L21/67G09F9/00
CPCH01L21/67017G09F9/00H01L21/67103H01L21/67109B23K20/1265B23K2101/40C23C16/45559C23C16/45565C23C16/4409C23C14/48B23K20/122B23K20/26H01L21/67248G02F1/1303B23K2101/14B23K2101/20
Inventor 安范模
Owner 安范模