Liquid cooling module and liquid cooling server

Abstract

The invention discloses a liquid cooling module and a liquid cooling server. The liquid cooling module comprises a heat exchange box, cold plates, gravity assisted heat pipes and fixed pressing pieces; the two parallel cold plates are connected through the gravity assisted heat pipes, and the outer sides of the gravity assisted heat pipes are sleeved with the fixed pressing pieces used for pressing and fixing the cold plate at the lower end; a heat exchange box is arranged on the cold plate at the upper end, and a liquid inlet nozzle and a liquid outlet nozzle are arranged on the side wall ofthe heat exchange box. A liquid cooling server comprises a case and a liquid cooling module; a fixed cover plate and a movable cover plate are arranged at the upper end of the case; the movable coverplate comprises a first cover plate and a second cover plate; the first cover plate is in butt joint with the fixed cover plate; the second cover plate is in butt joint with the first cover plate; aninstallation groove for containing the liquid cooling module is formed in the butt joint position of the second cover plate and the first cover plate, a baffle used for blocking is arranged in the installation groove, the heat exchange box is arranged outside the case, a liquid receiving groove is formed in the upper end of the second cover plate, and a liquid inlet pipe and a liquid return pipe which are communicated with the heat exchange box are arranged in the liquid receiving groove.

Description

technical field [0001] The invention relates to the technical field of server cooling, in particular to a liquid cooling module and a liquid cooling server. Background technique [0002] With the rapid development of the electronic information industry, the development of data centers has also entered a new stage. On the one hand, with the improvement of chip performance such as CPU and GPU, the power consumption of a single IT device is also getting higher and higher. On the other hand, the data center industry is also developing towards intensification, and the number of IT equipment deployed in a single cabinet is gradually increasing. This brings about the following problems: the heat generated in a single cabinet increases, while the cooling capacity of the traditional air-cooled mode is limited, which also limits the development of the data center industry in the direction of high power and high density. [0003] Therefore, we urgently need a new cooling method to co...

AI Technical Summary

Problems solved by technology

This brings about the following problems: the heat generated in a single cabinet increases, while the cooling capacity of the traditional air-cooled mode is limited, which also limits the development of the data center industry in the direction of high power and high density

But its disadvantages are also obvious: the entire liquid cooling module is installed inside the chassis, and the heat pipes need to run through the inside of the server chassis. Due to the structural layout inside the server, the number and specification (diameter) of the heat pipes cannot be increased, which makes The cooling module cannot meet the heat dissipation requirements of high-power servers, and there is a certain risk of liquid leakage during use, which may damage the internal components of the chassis

Images