Optimization device for expanding automatic screening and testing contact surface of chip

Abstract

The invention discloses an optimization device for expanding an automatic screening and testing contact surface of a chip, and the device comprises an insulating baffle plate which is disposed on theback surfaces of a golden finger fixing device and a golden finger, and the golden finger is disposed on the golden finger fixing device. According to the optimization device for expanding an automatic screening and testing contact surface of the chip provided by the invention, through reconstruction of the golden finger, the contact area between the golden finger and an IC pin can be effectivelyincreased, so that the impedance is reduced, some test items with strict requirements on the contact impedance, such as alternating current test and function test, are satisfied, the yield in the FT test process can be effectively improved, unnecessary secondary test or tertiary test is avoided, and the cost is reduced.

Description

Technical field [0001] The invention relates to the technical field of testing after semiconductor chip packaging, and more particularly to an optimization device for expanding the contact surface of automatic screening and testing of chips. Background technique [0002] Term explanation: [0003] FT: Test after semiconductor chip packaging; [0004] IC: The finished product after semiconductor chip packaging, the device under test; [0005] handler: automated equipment used in FT testing; [0006] Gold finger: the accessory that makes contact with the packaged chip. [0007] The commonly used handler in the FT test process is a gravity manipulator. This type of manufacturing structure is simple and the cost is relatively low, so the market share is relatively high. The contact method of the gravity manipulator and the IC is through the contact of the golden finger with the IC pin to realize the automated test of the FT test process. The contact between the gold finger and the IC pin ...

AI Technical Summary

Problems solved by technology

The contact between the gold finger and the IC pin is a point-to-point contact. Because it is a point-to-point contact, it is impossible to avoid deformation of the IC pin or the gold finger. This results in that the contact between the gold finger and the IC pin is not It is very close and sufficient, resulting in a smaller contact area between the two and a larger impedance, which will definitely affect the test and cause certain parameter tests to fail

In order to solve the problem of insufficient contact between the gravity manipulator and the IC, the current conventional solution is to increase the "force" applied by the IC pin to increase the "contact area" with the gold finger, relying on the hardness of the IC pin and the gold finger The ability of the hardness to achieve

The "applied force" is controllable for the gravity manipulator, but the "applied force" of the IC pin is definitely different from the "bearable force" of the golden finger, which will inevitably cause one of them to deform, making the two unable to Close contact, and the "applied force" cannot be increased without limit. There is always an upper limit to protect the IC

[0008] In order to solve the problem of insufficient contact between the gravity manipulator and the IC, the present invention provides an optimization device for expanding the automatic screening and testing contact surface of chips. Starting from the gold finger, an insulating gold finger-shaped gold finger is added to the back of the chip. Insulation board to ensure that the golden finger does not deform under the condition of "increasing force applied" by the IC pin, and has achieved the purpose of full contact

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