Plasma nano-polishing device and automatic polishing equipment for semi-closed inner hole metal workpieces

Abstract

The invention relates to the technical field of polishing, in particular to a plasma nano-polishing device and an automatic polishing device for a metal workpiece with a semi-closed inner hole; it includes a polishing conductive groove, a liquid storage chamber is arranged in the polishing conductive groove, and a heating mechanism is arranged inside the liquid storage chamber , the bottom of the liquid storage chamber is arranged at intervals with a plurality of conductive columns vertically connected to the bottom of the liquid storage chamber, each conductive column is provided with a drainage cavity, and each drainage cavity penetrates upwards through the top of the conductive column, and the bottom of the polished conductive groove is provided with a Each drainage chamber has a one-to-one corresponding lead-out hole, the lead-out hole is connected with the liquid inlet of the plasma liquid storage tank through the return line, the liquid outlet of the plasma liquid storage tank is connected with the liquid inlet of the polished conductive groove, and the plasma liquid storage tank is connected with the liquid inlet of the polished conductive groove. The return pipeline between the polishing conductive grooves is also connected with a liquid pump; it also includes a polishing workpiece conductive fixture, the polishing workpiece conductive fixture is electrically connected to the positive electrode of the power supply, and the polished conductive groove is electrically connected to the negative electrode of the power supply.

Description

technical field [0001] The invention relates to the technical field of polishing, in particular to a plasma nano-polishing device and automatic polishing equipment for metal workpieces with semi-closed inner holes. Background technique [0002] Polishing has always been an important link in the manufacturing process of metal products. At present, the commonly used polishing methods include mechanical polishing, chemical polishing, ultrasonic polishing, abrasive flow polishing, magnetic grinding and plasma nano-polishing. Among them, the cost of ultrasonic polishing, abrasive flow polishing and magnetic grinding is too high, and the scope of application is small. Although mechanical polishing can obtain a relatively flat surface, it is not suitable for polishing workpieces with complex shapes, and metal dust will be generated during the processing. Harmful to human health; chemical polishing can polish workpieces with complex shapes, but the polishing liquid used in chemical ...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a plasma nano-polishing device and semi-closed inner hole metal workpiece automatic polishing equipment, through the structural design of the plasma nano-polishing device and semi-closed inner hole metal workpiece automatic polishing equipment to solve the problems existing in the prior art Mechanical polishing produces dust, pollutes the environment, and is limited by the structure of polished parts, chemical polishing is easy to corrode, and the technical problems of polishing liquid pollute the environment

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