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A kind of low temperature curing one-component epoxy adhesive and its preparation method and application

An epoxy adhesive, one-component technology, used in epoxy resin adhesives, adhesives, organic chemistry, etc., can solve the problems of defective oxygen and moisture barrier properties, high transportation costs, short service life, etc. Stability issues, improved water repellency, and improved service life

Active Publication Date: 2022-07-22
重庆中科力泰高分子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing low-temperature curing epoxy glue for edge sealing of electronic paper needs to be stored and transported at -40 degrees Celsius, which has high transportation costs, short service life, and defects in the barrier performance to oxygen and moisture.

Method used

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  • A kind of low temperature curing one-component epoxy adhesive and its preparation method and application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Prepare a low-temperature curing one-component epoxy adhesive, and prepare according to the following method:

[0036] (1) Preparation of latent thiol: add epoxy-containing compound (1,3,5-triglycidyl isocyanurate) and thioacetic acid in turn, wherein 1,3,5-triglycidyl The molar ratio of epoxy group and thioacetic acid in isocyanurate is 1:1.2, adding tetrabutylammonium bromide as catalyst (the mass of tetrabutylammonium bromide is 1,3,5-triglycidyl) 0.5% of the total mass of isocyanurate and thioacetic acid), react at 95 ° C for 2 h, and then distill under reduced pressure to obtain latent thiol TGICS;

[0037] (2) In parts by weight, 45 parts of bisphenol A epoxy resin 128, 20 parts of bisphenol S epoxy resin, 20 parts of diphenol-based hexafluoropropane diglycidyl ether, 15 parts of glycidyl propyl octafluoropenta Ether, 1.0 parts of coupling agent (KH-560) and 1.0 parts of thixotropic thickener (Cabot TS720) were added to the planetary reaction kettle, and were sti...

Embodiment 2

[0041] Prepare a low-temperature curing one-component epoxy adhesive, and prepare according to the following method:

[0042] (1) Preparation of latent mercaptan: adding epoxy-containing compound (trimethylolpropane triglycidyl ether) and monothio acid compound (thiopropionic acid) in turn, wherein trimethylolpropane triglycidyl The mol ratio of epoxy group and thiopropionic acid in the ether is 1:1.5, and adding tetrabutylammonium bromide is a catalyst (the quality of tetrabutylammonium bromide is trimethylolpropane triglycidyl ether and thiopropane) 1.0% of the total mass of propionic acid), reacted at 85 ° C for 6 h, and distilled under reduced pressure to obtain latent thiol TMPEGS;

[0043](2) In parts by weight, 20 parts of UVR6103 epoxy resin, 10 parts of bisphenol F epoxy resin, 25 parts of 4080E hydrogenated bisphenol A epoxy resin, 40 parts of octafluorobiphenyl diglycidyl ether, 5 parts of shrunk Glyceryl propyl dodecafluoroheptyl ether, 2.0 parts of coupling agent...

Embodiment 3

[0047] Prepare a low-temperature curing one-component epoxy adhesive, and prepare according to the following method:

[0048] (1) Preparation of latent mercaptan: adding epoxy group-containing compound (pentaerythritol tetraglycidyl ether) and monothioacid compound (thioacetic acid) successively, wherein the epoxy group in pentaerythritol tetraglycidyl ether and thiol The molar ratio of acetic acid is 1:1.3, and tetrabutylammonium bromide is added as a catalyst (the mass of tetrabutylammonium bromide is 0.8% of the total mass of pentaerythritol tetraglycidyl ether and thioacetic acid), and the reaction is carried out at 90 ° C for 4h , distillation under reduced pressure to obtain latent thiol PETEGS;

[0049] (2) By weight, 25 parts of UVR6103 epoxy resin, 40 parts of 4080E hydrogenated bisphenol A epoxy resin, 25 parts of bis-(hexafluorohydroxypropyl) benzene diglycidyl ether, 10 parts of glycidyl propyl Hexafluorobutyl ether, 1.0 parts of coupling agent (KH-563) and 3.0 pa...

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Abstract

The invention relates to a low-temperature curing single-component epoxy glue, a preparation method and application thereof, and belongs to the field of electronic packaging materials. The epoxy adhesive of the present invention comprises the following materials in parts by weight: 40-75 parts of epoxy resin, 20-40 parts of fluorine-containing epoxy resin, 5-20 parts of mono-epoxy fluorine-containing epoxy monomer, latent mercaptan 40-100 parts, accelerator 0.1-10 parts, coupling agent 0.1-5 parts, thixotropic thickener 1-10 parts. The invention adopts fluorine-containing epoxy resin and mono-epoxy fluorine-containing epoxy monomer, and scientifically combines epoxy resin, latent thiol curing agent, accelerator, coupling agent, thixotropic thickener and other components at the same time. The content and combination of fluorine-containing epoxy resins and latent mercaptans solve the storage stability problem of low-temperature curing epoxy adhesives, and enable the adhesives to obtain excellent water resistance and oxygen barrier properties. Reliability in the field of edgebanding of paper displays.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and in particular relates to a low-temperature curing single-component epoxy adhesive and a preparation method and application thereof. Background technique [0002] Electronic paper technology is actually a general term for a type of technology, the English name E-paper, mostly using electrophoresis display technology (electrophoresis Display, EPD) as the display panel, its display effect is close to the natural paper effect, free from reading fatigue, so generally can The display technology that realizes comfortable reading like paper, ultra-thin and light, bendable, and ultra-low power consumption is called electronic paper technology. In the EPD electrophoresis display technology, the infiltration of oxygen and moisture will affect the quality of the display and destroy the electronic paper film, so the electronic paper protective film needs to be sealed. The high-hydrophobicity...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06C08G59/66C07C327/22
CPCC09J163/00C09J11/04C09J11/06C08G59/66C07C327/22C08L2203/206C08L2201/14C08L2205/025C08L2205/03C08L63/00C08K13/06C08K9/06C08K9/04C08K7/26C08K5/5435
Inventor 丁远有李有刚何彬余中孝
Owner 重庆中科力泰高分子材料有限公司
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