Deep ultraviolet LED device and preparation method thereof

Abstract

The invention discloses a deep ultraviolet LED device and a preparation method thereof, and the device comprises a substrate with a bonding pad on the upper surface, a support located on the upper surface of the substrate, and a glass lens located at the top of the support, the substrate, the support and the glass lens form a cavity, and the surfaces of the substrate and the support are respectively provided with conductive layers; the deep ultraviolet LED device further comprises an inverted eutectic UVC chip and an inverted eutectic electrostatic protection chip which are located in the cavity and arranged on the bonding pad of the substrate. According to the technical scheme provided by the invention, the inverted eutectic UVC chip and the inverted eutectic electrostatic protection chipare used as a UVC chip and an electrostatic protection chip in the deep ultraviolet LED device. In this way, the situation that the inverted eutectic UVC chip and the inverted eutectic electrostaticprotection chip fall off is avoided as much as possible, collapse and breakage can be avoided as much as possible, and then the reliability of the deep ultraviolet LED device can be improved.

Description

technical field [0001] The present application relates to the technical field of LED lighting, and more specifically, to a deep ultraviolet LED device and a preparation method thereof. Background technique [0002] With the gradual improvement of people's quality of life requirements, deep ultraviolet LED devices used for sterilization and disinfection in LED lighting have attracted widespread attention. [0003] Wherein, the deep ultraviolet LED device is used to provide deep ultraviolet UVC (specifically refers to ultraviolet light with a wavelength of 260nm-280nm), so as to use the deep ultraviolet UVC for sterilization and disinfection. For details, see figure 1 , which shows a schematic structural diagram of an existing deep ultraviolet LED device, which is packaged with a front-mounted UVC chip 01, a front-mounted electrostatic protection chip 02, a ceramic substrate 03, a glass 04, and a ceramic frame bracket 05, wherein the front-mounted UVC chip 01 and the front-mo...

AI Technical Summary

Problems solved by technology

However, since the silver paste glue 06 contains epoxy resin components, it is prone to failure under deep ultraviolet conditions, causing the front-mounted UVC chip 01 and the front-mounted electrostatic protection chip 02 to fall off, so that the device will eventually fail; There are gold wires 08 in it. Therefore, during the installation process, it is easy to collapse or break under the action of external force extrusion and touch, which will cause the failure of deep ultraviolet LED devices.

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