Modular integrated bone regeneration and repair capacity test chip and preparation method and application thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SICHUAN UNIV
- Publication Date
- 2020-05-19
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of biomedical engineering, and in particular relates to a test chip for bone regeneration and repair ability, a preparation method and application thereof.
[0002] technical background
[0003] Bone defect, that is, the destruction of the structural integrity of bone, is a common clinical disease. Irreversible bone defects caused by bone defects and osteoporosis, bone tumor resection, accident trauma, and congenital deformities have always been one of the major clinical challenges, resulting in a high demand for bone repair materials. According to statistics, more than 3.5 million patients need bone transplantation every year in my country, and the number is growing rapidly. With the improvement of people's health level, patients are no longer satisfied with orthopedic implants to relieve pain and restore basic motor functions, but to restore their original functions to the maximum extent.
[0004] Current...