A wafer multi-station edge polishing equipment

A multi-station, edge technology, applied in the direction of grinding/polishing equipment, metal processing equipment, machine tools suitable for grinding workpiece edges, etc., can solve the problems of easy embrittlement, low yield, high wafer hardness, etc., to achieve Reduces stress, improves usability, and avoids the effect of excessive shock

Active Publication Date: 2021-08-10
湖南科鑫泰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The wafer is formed by slicing the whole ingot. With the shrinking of the parts of the electronic device, the application of the wafer on the electronic device is gradually increasing. For the surface granularity, geometric parameters, edge and surface roughness of the wafer, more and more requirements are proposed. Strict requirements require grinding and polishing of the edge of the wafer. When the wafer is fixed under pressure, the hardness is too high and it is easy to become brittle, causing the wafer being polished to be separated from the middle and folded in half, and the polishing yield is low.

Method used

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  • A wafer multi-station edge polishing equipment
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  • A wafer multi-station edge polishing equipment

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Embodiment 1

[0030] see Figure 1-Figure 4 , a wafer multi-station edge polishing equipment, the present invention provides a wafer multi-station edge polishing equipment, its structure includes a fixed rod 1, a polishing system 2, a hydraulic cylinder 3, a body 4, the top surface of the body 4 There are two polishing systems 2, and a hydraulic cylinder 3 is arranged directly above the polishing system 2, and the hydraulic cylinder 3 is mechanically connected with the polishing system 2. The top of the body 4 is provided with a fixed rod 1, and the polishing system 2 Including air inlet 21, main rod 23, folding cylinder 24, fixed plate 25, and operating platform 27, the operating platform 27 is fixed directly above the body 4, and a fixed plate 25 is arranged directly above the operating platform 27, and the fixed plate 25 is provided with a folding cylinder 24 on the top surface. The folding cylinder 24 is a hollow structure. The air outlet 21 is mechanically connected with the air inlet...

Embodiment 2

[0035] see Figure 1-Figure 8 , a wafer multi-station edge polishing equipment, the present invention provides a wafer multi-station edge polishing equipment, its structure includes a fixed rod 1, a polishing system 2, a hydraulic cylinder 3, a body 4, the top surface of the body 4 There are two polishing systems 2, and a hydraulic cylinder 3 is arranged directly above the polishing system 2, and the hydraulic cylinder 3 is mechanically connected with the polishing system 2. The top of the body 4 is provided with a fixed rod 1, and the polishing system 2 Including air inlet 21, main rod 23, folding cylinder 24, fixed plate 25, and operating platform 27, the operating platform 27 is fixed directly above the body 4, and a fixed plate 25 is arranged directly above the operating platform 27, and the fixed plate 25 is provided with a folding cylinder 24 on the top surface. The folding cylinder 24 is a hollow structure. The air outlet 21 is mechanically connected with the air inlet...

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Abstract

The invention discloses a wafer multi-station edge polishing equipment, the structure of which comprises a fixed rod, a polishing system, a hydraulic cylinder, and a body. Two polishing systems are arranged on the top surface of the body, and a hydraulic cylinder is arranged directly above the polishing system. It is mechanically connected with the polishing system. There is a fixed rod on the top of the body. The polishing system includes an air inlet, a main rod, a folding cylinder, a fixed plate, and an operating platform. The operating platform is fixed directly above the machine body. The invention uses the mutual cooperation between the hydraulic cylinder, the main rod and the fixed plate to fix the wafer after the hydraulic cylinder is pressed down to prevent the relative sliding of the wafer when it is fixed. The invention cooperates with the fixed plate and the air inlet, etc., The wafer is adsorbed by means of air extraction, and the inner and outer rings are used to absorb and absorb the inside and outside of the wafer at the same time, so as to ensure that the wafer is evenly absorbed and will not break into two parts from the middle. Half.

Description

technical field [0001] The invention relates to the field of wafer cutting equipment, in particular to a wafer multi-station edge polishing equipment. Background technique [0002] The wafer is formed by slicing the whole ingot. With the shrinking of the parts of the electronic device, the application of the wafer on the electronic device is gradually increasing. For the surface granularity, geometric parameters, edge and surface roughness of the wafer, more and more requirements are proposed. Strict requirements require grinding and polishing of the edge of the wafer. When the wafer is fixed under pressure, the hardness is too high and it is easy to become brittle, causing the wafer being polished to be separated from the middle and split into two halves, resulting in a low polishing yield. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention is realized through the following technical solutions: a multi-station edge polish...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B9/06B24B41/00B24B41/02B24B41/06
CPCB24B9/065B24B41/00B24B41/02B24B41/06
Inventor 徐绪友
Owner 湖南科鑫泰电子有限公司
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