TSV vacuum laminating method, apparatus, and bonding system using same

A vacuum layer and vacuum technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of complex lamination, bonding and debonding processes, difficulty in maintenance, management and repair, and complex and large-scale devices and other problems, to achieve the effect of suppressing voids, saving maintenance and management costs, and simplifying process layout
CN111180367AActive Publication Date: 2020-05-19AP SYST INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AP SYST INC
Publication Date
2020-05-19

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Abstract

The present invention relates to a method for performing a laminating process for a TSV process. A technical point of the laminating method for the TSV process is to provide a vacuum laminating methodfor the TSV process, which includes: an adhesive film supplying step of supplying an adhesive film by using a transfer roller; an adhesive film cutting step of cutting the adhesive film into a predetermined shape by using a cutter; a primary protective film peeling step of bonding the adhesive film cut in the predetermined shape to a lower portion of an adhesive chuck to peel a primary protectivefilm formed on a lower portion of the adhesive film; an adhesive chuck separation step in which the adhesive chuck is separated from the adhesive film after the adhesive film, where the primary protective film is peeled off, is transferred to a vacuum laminator by the adhesive chuck and seated on the top of a carrier wafer; a vacuum laminating step of laminating the carrier wafer and the adhesivefilm seated on the top of the carrier wafer; and a secondary protective film peeling step of peeling a second protective film formed on the top of the adhesive film. Accordingly, the adhesive film and the carrier wafer are laminated in a vacuum state, thereby minimizing dusts and particles, so that high quality laminating is implemented.
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Description

technical field

[0001] The invention is used to implement a lamination process for a through silicon via (TSV, through silicon via) process, and relates to a vacuum lamination method for a TSV process, a vacuum laminating apparatus (vacuum laminating apparatus) for a TSV process, and bonding using the same The system, the above method, apparatus and system can perform lamination of an adhesive film and a carrier wafer in a vacuum state, thereby minimizing generation of dust and particles, thereby enabling high-quality lamination. Background technique

[0002] So far, researches on improving the integration degree of semiconductor devices have been continuously carried out. However, due to the physical limitations of exposure devices used to form circuit patterns, researchers in the field are faced with the difficult reality that they cannot further improve the integration level with existing equipment and methods.

[0003] Recently, some new technologies that can improve th...

Claims

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