Vacuum lamination method and device for tsv process and bonding system using same
A technology of vacuum layer and process, which is applied in the direction of lamination equipment, lamination, chemical instruments and methods, etc. It can solve the problems of complex lamination, bonding and debonding process, difficult maintenance, management and repair, complex and large-scale equipment, etc. problems, to achieve the effects of suppressing voids, saving maintenance and management costs, and simplifying process layout
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[0036] The present invention relates to a lamination process of a through-silicon via (Through Silicon Via, hereinafter referred to as "TSV") process for improving the integration degree of semiconductor elements.
[0037] In particular, an adhesive film capable of efficiently laminating an adhesive film to a carrier wafer for maintaining the strength of a device wafer relates to a vacuum lamination for high-quality vacuum lamination capable of suppressing generation of dust and particles.
[0038] Figure 1 to Figure 8 is a schematic diagram of the vacuum lamination process sequence and the main parts of the device according to the present invention, Figure 9 to Figure 11 is a diagram illustrating an example of a bonding system according to vacuum lamination in the present invention.
[0039] As shown in the figure, the adhesive film 10 and the carrier wafer 20 are laminated in a vacuum state in the present invention, so generation of dust and particles can be minimized, th...
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