Transverse field effect transistor

A field-effect transistor, horizontal technology, applied in the field of horizontal field-effect transistors, can solve problems such as increased power consumption, and achieve the effect of reducing the lateral size

Pending Publication Date: 2020-05-22
CHENGDU MONOLITHIC POWER SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reverse recovery phenomenon of the body diode of the traditional lateral field effect transistor (such as LDMOS) will le

Method used

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Examples

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Example Embodiment

[0025] Some embodiments of the present invention will be described in detail below. In the following description, some specific details, such as specific circuit structures in the embodiments and specific parameters of these circuit elements, are used to provide a better understanding of the embodiments of the present invention. Those skilled in the art can understand that the embodiments of the present invention can be implemented even in the absence of some details or the combination of other methods, elements, materials, and the like.

[0026] In the description and claims of the present invention, if words such as "left, right, inside, outside, front, back, up, down, top, above, bottom, and below" are used, they are only For ease of description, it does not indicate the necessary or permanent relative position of the components / structures. Those skilled in the art should understand that such words are interchangeable under appropriate circumstances, for example, so that the ...

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Abstract

The embodiment of the invention discloses a lateral field effect transistor. The lateral field effect transistor comprises a semiconductor layer, a well region, a body region, a source region, a drainregion, a gate structure and a trench Schottky barrier structure. The trench Schottky barrier structure longitudinally extends from the upper surface of the well region to penetrate through the source region, the body region and at least one part of the well region, so that longitudinal Schottky contact is formed between the side wall of the trench Schottky barrier structure and the well region.The longitudinal Schottky contact can be manufactured simultaneously with the lateral field effect transistor based on the process steps of manufacturing the lateral field effect transistor. The transverse size of the transverse field effect transistor integrated with the Schottky diode can be greatly reduced, so that the requirements of an integrated circuit application that the size and the volume of the transverse field effect transistor are smaller and smaller and the reverse leakage/reverse substrate injection suppression capability is good can be better met.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor devices, and more particularly to lateral field effect transistors. Background technique [0002] Lateral transistors, especially lateral double-diffused metal-oxide-semiconductor field-effect transistors (LDMOS), are widely used in various integrated power management circuits. However, the reverse recovery phenomenon of the body diode of the traditional lateral field effect transistor (such as LDMOS) will increase the power consumption of the LDMOS when it works as a switching device (especially when it works at a high switching frequency). Therefore, the current integrated circuit applications require lateral field effect transistors to have smaller and smaller sizes and volumes while having good reverse leakage / reverse substrate injection suppression capabilities and low switching losses. Contents of the invention [0003] Embodiments of the present disclosure provide a lateral field ef...

Claims

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Application Information

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IPC IPC(8): H01L29/06H01L29/47H01L29/78
CPCH01L29/7816H01L29/782H01L29/0684H01L29/47H01L29/0653H01L29/41766H01L29/0623H01L29/063H01L29/0692H01L29/1095
Inventor 陶宏傅达平
Owner CHENGDU MONOLITHIC POWER SYST
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