Electrostatic discharge method and device for electrostatic chuck

Abstract

The invention provides an electrostatic discharge method and device for an electrostatic chuck, and the device comprises: an electrostatic chuck which is provided with a wafer pin for lifting a wafer,wherein the electrostatic chuck is provided with a power supply and used for providing a fixed reverse voltage for the wafer when receiving the first power supply signal and providing stepped reversevoltage which is progressively increased in steps for the wafer when receiving the second power supply signal; and a processing unit which is used for judging whether the wafer pin reaches the pre-desorption position or not in a preset time period after the wafer pin is started to lift the wafer, and sending a first power supply signal for providing fixed reverse voltage or a second power supplysignal for providing stepped reverse voltage which is increased progressively according to a judgment result. By setting the reverse voltage applied to the electrostatic chuck and the stepped reversevoltage increased in a stepped manner, the judgment time is increased, the problem of electrostatic residue of the wafer after etching in the process cavity is finished can be effectively solved, andthe risk that the wafer deviates and is broken by a wafer pin in the conveying process is reduced.

Description

Technical field [0001] The invention belongs to the field of semiconductor manufacturing equipment design, and particularly relates to an electrostatic discharge method and device for an electrostatic chuck. Background technique [0002] In the integrated circuit chip manufacturing industry, the entire process of processing wafers generally includes processes such as photolithography, etching, ion implantation, metal deposition, and core packaging. In the plasma etching process, the etching machine transfers the photoresist patterns such as lines, surfaces or holes produced by the photolithography process to the material under the photoresist faithfully to form the entire integrated circuit. Architecture. In the packaging field, the overall thinning of device wafers and back packaging also require plasma etching processes. The above process is usually completed by placing the wafer on a chuck in the reaction chamber of the semiconductor processing equipment to process the wafer...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide an electrostatic discharge method and device for an electrostatic chuck, which is used to solve the problem of machine downtime and wafer fragments caused by the difficulty of completely releasing the static electricity of the electrostatic chuck in the prior art. question

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