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A kind of preparation method of micro-coaxial structure and micro-coaxial structure

A coaxial structure and substrate technology, applied in the field of micro-coaxial, can solve the problems of complex process, complex structure and process, and achieve the effects of simple process, low production cost and easy realization.

Active Publication Date: 2021-12-07
SHANGHAI MCT SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The present invention provides a method for preparing a micro-coaxial structure, a micro-coaxial structure and a micro-coaxial cable, so as to solve the biggest shortcoming of realizing micro-coaxial by electroplating in the prior art that the process is complex and requires multiple electroplating, and Chemical-mechanical grinding is required between each electroplating to achieve planarization, and the structure and process are relatively complex technical problems

Method used

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  • A kind of preparation method of micro-coaxial structure and micro-coaxial structure
  • A kind of preparation method of micro-coaxial structure and micro-coaxial structure
  • A kind of preparation method of micro-coaxial structure and micro-coaxial structure

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preparation example Construction

[0039] A method for preparing a micro-coaxial structure, comprising:

[0040] The first substrate and the second substrate are made of materials with low dielectric constant and low loss;

[0041] A first through groove, a second through groove, an upper cavity, a lower cavity, an upper groove of the first cover plate and a lower groove of the second cover plate are provided through the first substrate and the second substrate;

[0042] Adding a first cover plate and a second cover plate above and below the first substrate and the second substrate of the clamped mold;

[0043] The upper groove, the first through groove, the lower groove, and the second through groove jointly form a through groove cavity structure, and the upper cavity and the lower cavity also form an inner cavity structure. In the two cavity structures The metal medium is filled respectively to form a through-slot metal layer and a cavity metal layer;

[0044] removing the first cover and the second cover f...

no. 1 example

[0048] see Figure 1A and Figure 1B , which is the first micro-coaxial fabrication method including media, including:

[0049] S110: providing a first substrate 10 and a second substrate 20 . In this example, the first substrate 10 and the second substrate 20 may use glass media, or may use insulating media including ceramics and plastics. The size and shape of the first substrate 10 and the second substrate 20 are generally the same for convenience in subsequent fabrication. Glass medium, ceramics, plastics and other insulating mediums with certain high temperature resistance are sufficient. In the present invention, these insulating media can be provided in a sheet form and are relatively easy to process such as grooves.

[0050] S120: Process the upper cavity 11 and the lower cavity 21 at the same middle position of the first substrate 10 and the second substrate 20 respectively, and in the cavity of the first substrate 10 and the second substrate 20 The upper and lowe...

no. 2 example

[0082] see Figure 5A and Figure 5B , which is the view from different perspectives of the second micro-coaxial fabrication method including medium, including:

[0083] S210: Provide the first substrate 50 and the second substrate 60. In this example, the first substrate 50 and the second substrate 60 may use glass media, or may use insulating media including ceramics and plastics. The size and shape of the first substrate 50 and the second substrate 60 are generally the same for convenience in subsequent fabrication. Glass medium, ceramics, plastics and other insulating mediums with certain high temperature resistance are sufficient. In the present invention, these insulating media can be provided in a sheet form and are relatively easy to process such as grooves.

[0084] S220: Process the upper cavity 51 and the lower cavity 61 at the same central position of the first substrate 50 and the second substrate 60 respectively, and in the cavity of the first substrate 50 an...

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Abstract

A method for preparing a micro-coaxial structure and a micro-coaxial structure. The structure includes an outer metal frame, a glass medium inside the metal frame, and a metal electrode inside the glass medium. The metal electrode and the metal frame form a coaxial structure. The method includes: setting a first through groove, a second through groove, an upper cavity, a lower cavity, an upper groove of the first cover plate and a lower groove of the second cover plate through the first substrate and the second substrate Groove; a first cover plate and a second cover plate are respectively added above and below the first substrate and the second substrate; the upper groove, the first through groove, the lower groove and the second through groove jointly form a through groove cavity body structure, and the upper cavity and the lower cavity also form an inner cavity structure, and the metal medium is filled in the two cavity structures respectively to form a metal layer of the through groove and a metal layer of the cavity; remove the first cover plate and the second The cover plate is subjected to a demoulding operation; a stepped port is formed at both ends of the first substrate and the second substrate respectively, exposing the metal and serving as an input port and an output port of the micro-coaxial structure.

Description

technical field [0001] The invention relates to micro-coaxial technology, in particular to a micro-coaxial structure containing a medium and a preparation method of the micro-coaxial structure. Background technique [0002] Transmission lines are the basis of microwave systems, and microwave transmission lines are used in various passive components, filters, matching networks, and microwave integrated circuits. There are many types of transmission lines currently available, including stripline, microstrip, coupled line, slotline, and coplanar waveguide. With the application of microwave and millimeter wave frequency band circuits and even higher frequency band systems, the transmission performance of the traditional planar transmission line structure will be greatly reduced due to the problems of dielectric and radiation loss and the limitation of high-order modal excitation. In millimeter-wave circuits, although the loss of slot lines and waveguides is relatively small, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/06H01P11/00
CPCH01P3/06H01P11/005
Inventor 顾杰斌夏伟锋魏旭东
Owner SHANGHAI MCT SEMICON CO LTD